Effect of different abrasives on chemical mechanical polishing for magnesia alumina spinel

被引：0
作者：
Wang Z. [1 ]
Pang M. [1 ]
Su J. [1 ]
Yao J. [1 ,2 ]
机构：
[1] School of Mechanical and Electrical Engineering, Henan Institute of Science and Technology, Xinxiang
[2] College of Mechanical and Electrical Engineering, Nanjing Univ. of Aeronautics and Astronautics, Nanjing
来源：
Key Engineering Materials | 2020年 / 866卷
基金：
中国国家自然科学基金;
关键词：
Abrasive; Chemical mechanical polishing; Magnesium aluminate spinel; Materials removal rate; Surface quality;
D O I：
10.4028/www.scientific.net/KEM.866.115
中图分类号：
学科分类号：
摘要：
In this paper, a series of chemical mechanical polishing (CMP) experiments for magnesia alumina (Mg-Al) spinel were carried out with different abrasives, and the materials removal rate (MRR) and surface quality was evaluated to explore their different effects. The scanning electron microscope (SEM) and laser particle size analyzer were also employed to test the micro-shape and size distribution of abrasives. Then, the mechanism of different effects with different abrasives was analyzed in CMP for Mg-Al spinel. Those experimental results suggest that different subjecting pressure ratios of abrasives to polishing pad with different abrasive are the key factors leading to difference polishing performances in CMP. © 2020 Trans Tech Publications Ltd, Switzerland.
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页码：115 / 124
页数：9
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