Progress on Research of Reliability of Thermal Interface Materials

被引：0

作者：

Wang T. ^{[1
]}

Qin W. ^{[1
,2
]}

Huang F. ^{[1
]}

Shu D. ^{[2
]}

Wang H. ^{[1
]}

Sun J. ^{[2
]}

Wang C. ^{[1
,2
,3
]}

Yue W. ^{[1
,3
]}

机构：

[1] College of Engineering and Technology, China University of Geosciences (Beijing), Beijing

[2] HYMN Advance Materials Technology (Shenzhen), Shenzhen

[3] Zhengzhou Institute, China University of Geosciences (Beijing), Zhengzhou

来源：

Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering | 2022年 / 38卷 / 07期

关键词：

Basis material; Production process; Reliable performance; Thermal conductive filler; Thermal interface material;

D O I：

10.16865/j.cnki.1000-7555.2022.0157

中图分类号：

学科分类号：

摘要：

The main role of thermal interface materials (TIM) is to fill the pore defects between chip and radiator, establish heat conduction pathway, and improve heat dissipation performance of electronic devices. Most of the existing studies were focused on the exploration of high thermal conductivity and excellent mechanical properties of TIM, and the importance of TIM's reliable performance was often ignored. In this paper, the development status of TIM reliability performance in recent years was reviewed, and the effects of thermal filler matrix material and production process on TIM reliability were mainly analyzed, including the types of thermal filler and compounding methods, the types of silicone oil, viscosity, crosslinking density and reaction rate of raw materials pretreatment storage environment of raw materials and processing methods, and put forward solutions to effectively improve TIM's reliable performance. Finally, some feasible suggestions for TIM's future research direction were put forward. © 2022, Editorial Board of Polymer Materials Science & Engineering. All right reserved.

引用

页码：183 / 190

页数：7

共 40 条

[1]

Saidina D S, Abdullah M Z, Hussin M., Metal oxide nanofluids in electronic cooling: a review, Journal of Materials Science: Materials in Electronics, 31, pp. 4381-4398, (2020)

[2]

Islam A M, Lim H, You N H, Et al., Enhanced thermal conductivity of liquid crystalline epoxy resin using controlled linear polymerization, ACS Macro Letters, 7, pp. 1180-1185, (2018)

[3]

Zou F, Budtova T., Polysaccharide-based aerogels for thermal insulation and superinsulation: an overview, Carbohydrate Polymers, 266, (2021)

[4]

Gu H, Wang J, Wei X, Et al., Thermal conductivity and interfacial thermal resistance in the heterostructure of silicon/ amorphous silicon dioxide: the strain and temperature effect, Nanotechnology, 31, (2020)

[5]

Islam A M, Lim H, You N H, Et al., Enhanced thermal conductivity of liquid crystalline epoxy resin using controlled linear polymerization, ACS Macro Letters, 7, 10, pp. 1180-1185, (2018)

[6]

Pathumudy R D, Prabhu K N., Thermal interface materials for cooling microelectronic systems: present status and future challenges, Journal of Materials Science: Materials in Electronics, 32, pp. 11339-11366, (2021)

[7]

Metayrek Y, Kociniewski T, Khatir Z., Thermal mapping at the cell level of chips in power modules through the silicone gel using thermoreflectance, Microelectronics Reliability, 105, pp. 113563-113563, (2020)

[8]

Goby J F, Jerome R, Vanhoorne P., Synthesis and preliminary characterization of model liquid crystalline ionomers, Macromolecules, 29, pp. 3376-3383, (1996)

[9]

Bahru R, Zamri M F M A, Shamsuddin A H, Et al., A review of thermal interface material fabrication method toward enhancing heat dissipation, International Journal of Energy Research, 45, pp. 3548-3568, (2020)

[10]

Yuan Z, Ma H, Hussien M A, Et al., Development and challenges of thermal interface materials: a review, Macromolecular Materials and Engineering, 306, (2021)

← 1 2 3 4 →