共 31 条
- [1] XIE Zongkui, ZHAO Zhibin, KE Junji, Et al., Stray inductance extraction of SiC MOSFET device package and test platform, High Voltage Engineering, 45, 2, pp. 586-592, (2019)
- [2] CAPONET M C, PROFUMO F, DE DONCKER R W, Et al., Low stray inductance bus bar design and construction for good EMC performance in power electronic circuits, IEEE Transactions on Power Electronics, 17, 2, pp. 225-231, (2002)
- [3] WANG Lina, MA Haobo, YUAN Kai, Et al., Modeling and influencing factor analysis of SiC MOSFET half-bridge circuit switching transient overcurrent and overvoltage, Transactions of China Electrotechnical Society, 35, 17, pp. 3652-3665, (2020)
- [4] YANG Yuan, WEN Yang, LI Guoyu, Review on high-power IGBT module and drive circuit, High Voltage Engineering, 44, 10, pp. 3207-3220, (2018)
- [5] LIU Xin, WANG Litong, LIANG Guishu, Et al., Key influencing factors on the turn-off transient voltage overshoot of IGBT in the module of high voltage DC circuit breaker, High Voltage Engineering, 46, 8, pp. 2654-2662, (2020)
- [6] ZHU Junjie, YUAN Jingxin, NIE Ziling, Et al., Optimum design of planer busbar based on all-silicon carbide power module, Proceedings of the CSEE, 39, 21, pp. 6383-6393, (2019)
- [7] LIU Yan, YANG Xiaofeng, YAN Chengzhang, Et al., Suppression of voltage spike in resonant switched capacitor converter considering parasitic inductance, Transactions of China Electrotechnical Society, 36, 12, pp. 2627-2639, (2021)
- [8] DUAN Liyang, LIU Feipeng, XU Lie, Et al., Improved modulation strategy for three-level ANPC topology with high stray inductance, High Voltage Engineering, 47, 2, pp. 637-644, (2021)
- [9] AKAGI H, DOUMOTO T., A passive EMI filter for preventing high-frequency leakage current from flowing through the grounded inverter heat sink of an adjustable-speed motor drive system, IEEE Transactions on Industry Applications, 41, 5, pp. 1215-1223, (2005)
- [10] GENG Chengfei, YANG Bo, WU Xiang, Et al., Coupled over-voltage analysis and decoupling method of IGBT on the one laminated bus-bar based on back to back three-level converter, Transactions of China Electrotechnical Society, 35, pp. 440-449, (2020)