Molecular Dynamics Simulations of Solid-State Bonding Behavior for Electronics Packaging*

被引：0
|
作者：
Hiroaki T. [1 ]
机构：
[1] Joining and Welding Research Institute, Osaka University
来源：
Yosetsu Gakkai Shi/Journal of the Japan Welding Society | 2024年 / 93卷 / 03期
关键词：
D O I：
10.2207/jjws.93.149
中图分类号：
学科分类号：
摘要：
[No abstract available]
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页码：149 / 153
页数：4
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