Molecular Dynamics Simulations of Solid-State Bonding Behavior for Electronics Packaging*

被引：0

|

作者：

Hiroaki T. ^{[1
]}

机构：

[1] Joining and Welding Research Institute, Osaka University

来源：

Yosetsu Gakkai Shi/Journal of the Japan Welding Society | 2024年 / 93卷 / 03期

关键词：

D O I：

10.2207/jjws.93.149

中图分类号：

学科分类号：

摘要：

[No abstract available]

引用

收藏

页码：149 / 153

页数：4

相关论文

共 50 条

[31] MOLECULAR-DYNAMICS AND MONTE-CARLO SIMULATIONS IN SOLID-STATE AND ELEMENTARY PARTICLE PHYSICS
BOWLER, KC
PAWLEY, GS
PROCEEDINGS OF THE IEEE, 1984, 72 (01) : 42 - 55
[32] Exotic structural motifs in aluminosilicate glasses quantified by solid-state NMR and molecular dynamics simulations
Stevensson, Baltzar
Eden, Mattias
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2021, 569
[33] MOLECULAR RECOGNITION IN THE SOLID-STATE - HYDROGEN-BONDING CONTROL OF MOLECULAR AGGREGATION
FAN, E
VICENT, C
GEIB, SJ
HAMILTON, AD
CHEMISTRY OF MATERIALS, 1994, 6 (08) : 1113 - 1117
[34] SOLID-STATE ANALYSIS IN ELECTRONICS AND MICROELECTRONICS
PFISTERER, H
FUCHS, E
SIEMENS FORSCHUNGS-UND ENTWICKLUNGSBERICHTE-SIEMENS RESEARCH AND DEVELOPMENT REPORTS, 1985, 14 (04): : 148 - 152
[35] SOLID-STATE POWER ELECTRONICS IN USA
STORM, HF
IEEE SPECTRUM, 1969, 6 (10) : 49 - &
[36] CONSUMER SOLID-STATE ELECTRONICS CHALLENGE
VONDERSC.BV
IEEE TRANSACTIONS ON BROADCAST AND TELEVISION RECEIVERS, 1973, BT19 (03): : R12 - R15
[37] SOLID-STATE DEVICES FOR AUTOMOTIVE ELECTRONICS
不详
AUTOMOTIVE ENGINEERING, 1974, 82 (04): : 32 - 37
[38] ELEMENTARY COURSE IN SOLID-STATE ELECTRONICS
不详
ELETTROTECNICA, 1972, 59 (04): : 389 - &
[39] ELEMENTARY COURSE IN SOLID-STATE ELECTRONICS
不详
ELETTROTECNICA, 1972, 59 (01): : 25 - &
[40] FR ELECTRONICS SOLID-STATE RELAYS
不详
MACHINERY AND PRODUCTION ENGINEERING, 1970, 116 (2991): : 395 - &

← 1 2 3 4 5 →