Wafer temperature monitoring technology in integrated circuit manufacturing process

被引：0
作者：
Jia J. [1 ]
Zhong Y. [1 ]
Zhang Z. [1 ]
Jiang J. [1 ]
Wang C. [1 ]
机构：
[1] School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu
来源：
Yi Qi Yi Biao Xue Bao/Chinese Journal of Scientific Instrument | 2021年 / 42卷 / 01期
关键词：
Contact; Non-contact; Temperature monitoring; Wafer;
D O I：
10.19650/j.cnki.cjsi.J2006961
中图分类号：
学科分类号：
摘要：
With the continuous development of integrated circuits, low power consumption and small area have gradually become the important specifications in chip design, which promotes the continuous reduction in the size of the devices that constitute the circuit. In the semiconductor chip manufacturing process, smaller device size has higher requirements for temperature control accuracy in the process. The slight deviation of the wafer temperature and the temperature non-uniformity higher than 1% will directly affect the yield of the final product. In order to achieve high-precision control of temperature and temperature field distribution, more accurate pre-detection and real-time acquisition are necessary, which pushes the wafer temperature monitoring technology in the integrated circuit manufacturing come into being. Focuses on the two main directions of contact and non-contact temperature measurement technologies, introduces the principles of the temperature monitoring technologies applied in the temperature monitoring range of 0℃~1 300℃, based on the principles analyzes the advantages and drawbacks of various technologies in detail, keeps track the development status of various each temperature measurement technologies both at home and abroad, and looks forward to the future development of wafer temperature monitoring technology. © 2021, Science Press. All right reserved.
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页码：15 / 29
页数：14
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