Experimental study on novel heat dissipation based on sky radiative cooling and micro-channel heat pipe

被引：0

作者：

Yu, Cairui ^{[1
,2
]}

Shen, Dongmei ^{[2
]}

He, Wei ^{[1
]}

Hu, Zhongting ^{[1
]}

机构：

[1] College of Civil Engineering, Hefei University of Technology, Hefei,230009, China

[2] School of Architecture and Civil Engineering, West Anhui University, Lu'an,237012, China

来源：

Taiyangneng Xuebao/Acta Energiae Solaris Sinica | 2020年 / 41卷 / 07期

关键词：

Electromagnetic wave emission - Aluminum coatings - Energy utilization - Cooling systems - Radiative Cooling - Electronic cooling;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

In order to prevent the abnormal running of electronic components caused by heat dissipation, a novel type of heat dissipation method combining micro-channel heat pipe(MHP) and sky radiative cooling(RC) was proposed. To test the heat dissipation effect of this method, three different types of radiative cooling plates were made, including RC plates(A) coated with acrylic resin, RC plate(B) sticked with the PTFE film and a bare aluminum plate RC plate (C). After two consecutive days of experimental testing, the results showed that: 1) the hemispheric emissivity of the RC plate A and B are respectively above 0.9 and 0.7, respectirely, and the emissivity of the atmospheric window band are 0.916 and 0.842, respectively; 2) the average temperature of the electronic components using the RC plate A was respectively 0.9 and 5.1℃ lower than that of the RC plates B and C; 3) the equivalent heat dissipation coefficients of RC plates A and B were 4.0-8.0W/(m2•K) and 3.5-6.5 W/(m2•K), respectively. Therefore, the designed cooling system could improve the cooling capacity of electronic components and reduce energy consumption for its heat dissipation. © 2020, Solar Energy Periodical Office Co., Ltd. All right reserved.

引用

页码：251 / 258