Effect of lapping load on self-conditioning performance of fixed agglomerated abrasive pad

被引：0
作者：
Niu F.-L. [1 ]
Zhu Y.-W. [1 ]
Shen G.-M. [1 ]
Wang Z.-K. [1 ]
Wang K.-R. [1 ]
机构：
[1] Jiangsu Key Laboratory of Precision and Micro-manufacturing Technology, College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing
来源：
Guangxue Jingmi Gongcheng/Optics and Precision Engineering | 2020年 / 28卷 / 02期
关键词：
Agglomerated diamond; Ceramic binder concentration; Fixed abrasive pad; Material removal rate; Self-conditioning;
D O I：
10.3788/OPE.20202802.0372
中图分类号：
学科分类号：
摘要：
During the process of fixed abrasive (FA) lapping, the micro-fracture of abrasives is the main approach to realize the self-conditioning process of the FA pad; the lapping load is one of the key parameters that affects it. The FA pads were prepared by using single diamond (SD) and agglomerated diamond (AD) abrasives. Marathon lapping tests were carried out, using quartz glass as the workpiece under a lapping load of 15 kPa. The material removal rate (MRR) and machining stability of the two FA pads were comparedtogether. Four kinds of AD abrasives with different concentrations of the ceramic binder were prepared and chosen as the abrasives to prepare the corresponding fixed AD abrasive (FADA)pads; their self-conditioning performance was evaluated under different lapping loads. The surface roughness(Ra) and morphology of the lapped quartz glass were observed. The results show that: the Ra of quartz glass lapped using the FADA pad is lower than of that lapped using fixed SD abrasive(FSDA) pad and that the former has a greater machining stability. Under a higher lapping load of 15-21 kPa, the FADA pad with the second highest ceramic binder concentration has the highest lapping efficiency; its MRR is 8.94-12.43 μm/min and Ra is approximately 60 nm. Under a lower load of 3.5-7 kPa, the FADA pad with the second lowest ceramic binder concentration is the most stable; its MRR is 2.67-3.12 μm/min; the Ra is approximately 40 nm. AD abrasive with a high ceramic binder concentration is more suitable as the abrasive for a FA pad in high-load applications, while that with a low concentration is more suitable for low-load applications. © 2020, Science Press. All right reserved.
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页码：372 / 381
页数：9
相关论文
共 19 条
[1]  
Zhu Y.W., Wang J., Li J., Et al., Research on the polishing of silicon wafer by fixed abrasive pad, China Mechanical Engineering, 20, 6, (2009)
[2]  
Kim H., Park B., Lee S., Et al., Self-conditioning fixed abrasive pad in CMP, Journal of the Electrochemical Society, 151, 12, pp. G858-G862, (2004)
[3]  
Van-Der-Velden P., Chemical mechanical polishing with fixed abrasives using different subpads to optimize wafer uniformity, Microelectronic Engineering, 50, 1, pp. 41-46, (1999)
[4]  
Zhu N.N., Zhu Y.W., Jun X., Et al., Modeling and validation of indentation depth of abrasive grain into lithium niobate wafer by fixed-abrasive lapping, Transactions of Nanjing University of Aeronautics and Astronautics, 34, 1, pp. 97-104, (2018)
[5]  
Lin K., Zhu Y.W., Li J., Et al., Study on lapping of K9 glass by fixed abrasive pad, Bulletin of the Chinese Ceramic Society, 29, 1, pp. 6-11, (2010)
[6]  
Wang Z.K., Zhu Y.W., Zhu L., Et al., Effect of triethanolamine in lapping spinel using fixed abrasive pad, Opt. Precision Eng., 23, 4, pp. 1034-1043, (2015)
[7]  
Choi J.Y., Jeong H.D., A study on polishing of molds using hydrophilic fixed abrasive pad, International Journal of Machine Tools & Manufacture, 44, 11, pp. 1163-1169, (2004)
[8]  
Kim H.Y., Kim H., Jeong H., Et al., Self-conditioning of encapsulated abrasive pad in chemical mechanical polishing, Journal of Materials Processing Technology, 142, 3, pp. 614-618, (2003)
[9]  
Xu J., Zhu Y.W., Zhu N.N., Et al., Self-conditioning mechanism of hydrophilic fixed abrasive pad, Nanotechnology and Precision Engineering, 12, 6, pp. 429-434, (2014)
[10]  
Wang Z.K., Zhu Y.W., Jin Z.H., Et al., Effect of ethanol solution on self-condition property of hydrophilic fixed abrasive pad, Opt. Precision Eng., 26, 4, pp. 843-849, (2018)
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