共 50 条
- [1] System I/O Optimization with SoC, SiP, PCB Co-Design 2015 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2015,
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- [3] Chip-Package-PCB Thermal Co-Design for Hot Spot Analysis in SoC 2012 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2012, : 215 - 218
- [4] SoC Design with HW/SW Co-Design Methodology for Wireless Communication System 2017 17TH INTERNATIONAL SYMPOSIUM ON COMMUNICATIONS AND INFORMATION TECHNOLOGIES (ISCIT), 2017,
- [5] Hardware/Software co-design SoC-system for a Neural Network trained by Particle Swarm Optimization 2017 IEEE 10TH INTERNATIONAL WORKSHOP ON COMPUTATIONAL INTELLIGENCE AND APPLICATIONS (IWCIA), 2017, : 1 - 1
- [6] Chip-Package-PCB Co-Design for Optimization of Wireless Receiver Performance 2012 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2012, : 116 - 119
- [7] Co-design for an SoC embedded network controller Journal of Zhejiang University-SCIENCE A, 2006, 7 (4): : 591 - 596
- [9] μI/O architecture:: A power-aware interconnect circuit design for SoC and SiP IEICE TRANSACTIONS ON ELECTRONICS, 2004, E87C (04): : 589 - 597
- [10] Package-silicon co-design - Experiment with an SOC design 17TH INTERNATIONAL CONFERENCE ON VLSI DESIGN, PROCEEDINGS: DESIGN METHODOLOGIES FOR THE GIGASCALE ERA, 2004, : 531 - 536