Softening implantable bioelectronics: Material designs, applications, and future directions

被引:3
作者
Oh, Subin [1 ]
Lee, Simok [1 ]
Kim, Sung Woo [1 ]
Kim, Choong Yeon [1 ]
Jeong, Eun Young [1 ]
Lee, Juhyun [1 ]
Kwon, Do A. [1 ,2 ]
Jeong, Jae-Woong [1 ,3 ]
机构
[1] Korea Adv Inst Sci & Technol KAIST, Sch Elect Engn, Daejeon 34141, South Korea
[2] Korea Adv Inst Sci & Technol KAIST, Dept Mat Sci & Engn, Daejeon 34141, South Korea
[3] KAIST Inst Hlth Sci & Technol, Daejeon 34141, South Korea
基金
新加坡国家研究基金会;
关键词
Softening; Implantable; Bioelectronics; Stimuli-responsive materials; Stiffness modulation; SILK FIBROIN; BIODEGRADABLE POLYMERS; MECHANICAL-PROPERTIES; CROSS-LINKING; HYDROGELS; METAL; SOFT; FABRICATION; CHITOSAN; FILMS;
D O I
10.1016/j.bios.2024.116328
中图分类号
Q6 [生物物理学];
学科分类号
071011 ;
摘要
Implantable bioelectronics, integrated directly within the body, represent a potent biomedical solution for monitoring and treating a range of medical conditions, including chronic diseases, neural disorders, and cardiac conditions, through personalized medical interventions. Nevertheless, contemporary implantable bioelectronics rely heavily on rigid materials (e.g., inorganic materials and metals), leading to inflammatory responses and tissue damage due to a mechanical mismatch with biological tissues. Recently, soft electronics with mechanical properties comparable to those of biological tissues have been introduced to alleviate fatal immune responses and improve tissue conformity. Despite their myriad advantages, substantial challenges persist in surgical handling and precise positioning due to their high compliance. To surmount these obstacles, softening implantable bioelectronics has garnered significant attention as it embraces the benefits of both rigid and soft bioelectronics. These devices are rigid for easy standalone implantation, transitioning to a soft state in vivo in response to environmental stimuli, which effectively overcomes functional/biological problems inherent in the static mechanical properties of conventional implants. This article reviews recent research and development in softening materials and designs for implantable bioelectronics. Examples featuring tissue-penetrating and conformal softening devices highlight the promising potential of these approaches in biomedical applications. A concluding section delves into current challenges and outlines future directions for softening implantable device technologies, underscoring their pivotal role in propelling the evolution of next-generation bioelectronics.
引用
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页数:19
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