Research progress of low temperature sintering nano-silver paste

[1] Watson J, Castro G., High-temperature electronics pose design and reliability challenges, Analog Dialogue, 46, 2, pp. 3-9, (2012)

[2] Chen Chuantong, Zhang Hao, Jiu Jingting, Et al., Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test, China Welding, 31, 1, pp. 15-21, (2022)

[3] Johnson R W, Evans J L, Jacobsen P., The changing automotive environment: high-temperature electronic[J], IEEE Transactions on Electronics Packaging Manufacturing, 27, 3, pp. 164-176, (2004)

[4] Yang J., A silicon carbide wireless temperature sensing system for high temperature applications, Sensors, 13, 2, pp. 1884-1901, (2013)

[5] Lea M C., Allotropic forms of silver[J], American Journal of Science, 37, 222, pp. 476-491, (1889)

[6] Schwarzbauer H, Kuhnert R., Novel large area joining technique for improved power device performance, IEEE Transactions on Industry Applications, 27, 1, (1991)

[7] Vitos L, Ruban A V, Skriver H L, Et al., The surface energy of metals[J], Surface Science, 411, 1-2, pp. 186-202, (1998)

[8] Manikam V R., Die-attach materials for high temperature applications in microelectronics packaging, (2019)

[9] Ide E, Angata S, Hirose A, Et al., Metal–metal bonding process using Ag metallo-organic nanoparticles, Acta Materialia, 53, 8, pp. 2385-2393, (2005)

[10] Alarifi H, Hu A M, Yavuz M, Et al., Silver nanoparticle paste for low-temperature bonding of copper[J], Journal of Electronic Materials, 40, 6, pp. 1394-1402, (2011)

[1] Watson J, Castro G., High-temperature electronics pose design and reliability challenges, Analog Dialogue, 46, 2, pp. 3-9, (2012)

[2] Chen Chuantong, Zhang Hao, Jiu Jingting, Et al., Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test, China Welding, 31, 1, pp. 15-21, (2022)

[3] Johnson R W, Evans J L, Jacobsen P., The changing automotive environment: high-temperature electronic[J], IEEE Transactions on Electronics Packaging Manufacturing, 27, 3, pp. 164-176, (2004)

[4] Yang J., A silicon carbide wireless temperature sensing system for high temperature applications, Sensors, 13, 2, pp. 1884-1901, (2013)

[5] Lea M C., Allotropic forms of silver[J], American Journal of Science, 37, 222, pp. 476-491, (1889)

[6] Schwarzbauer H, Kuhnert R., Novel large area joining technique for improved power device performance, IEEE Transactions on Industry Applications, 27, 1, (1991)

[7] Vitos L, Ruban A V, Skriver H L, Et al., The surface energy of metals[J], Surface Science, 411, 1-2, pp. 186-202, (1998)

[8] Manikam V R., Die-attach materials for high temperature applications in microelectronics packaging, (2019)

[9] Ide E, Angata S, Hirose A, Et al., Metal–metal bonding process using Ag metallo-organic nanoparticles, Acta Materialia, 53, 8, pp. 2385-2393, (2005)

[10] Alarifi H, Hu A M, Yavuz M, Et al., Silver nanoparticle paste for low-temperature bonding of copper[J], Journal of Electronic Materials, 40, 6, pp. 1394-1402, (2011)