Molecular dynamics simulation study of sintering mechanism and thermal conductivity of nano-Ag particles

[11] Ide E, Angata S, Hirose A, Et al., Metal–metal bonding process using Ag metallo-organic nanoparticles, Acta Materialia, 53, 8, pp. 2385-2393, (2005)

[12] Bai J G, Zhiye Z Z, Calata J N, Et al., Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material[J], IEEE Transactions on Components and Packaging Technologies, 29, 3, pp. 589-593, (2006)

[13] He Xiaobin, Molecular dynamics simulation of metal nanowire connections, (2013)

[14] Wu Mao, Chang Lingling, Cui Yanan, Molecular dynamics simulation of the melting and sintering process of gold nanoparticles, Powder Metallurgy Materials Science and Engineering, 18, 6, pp. 775-782, (2013)

[15] Suzuki T, Terasaki T, Kawana Y, Et al., Effect of manufacturing process on micro-deformation behavion of sintered-silver dia-attach material[J], IEEE Transactions on Device and Material Reliability, 16, pp. 588-596, (2016)

[16] Jiang Shan, Zhang Yuwen, Hao Peng, Molecular dynamics study of neck growth in laser sintering of hollow silver nanoparticles with different heating rates, Journal of Physics D:Applied Physics, 46, (2013)

[17] Wang Xin, Lu Dan, Shen Shengping, Non-equilibrium molecular dynamics study of the thermal conductivity of Ni/Al laminated structures, Science China: Physics, Mechanics & Astronomy, 44, pp. 506-513, (2014)

[18] Lange A P, Samanta A, Majidi H, Et al., Dislocation mediated alignment during metal nanoparticle Coalescence[J], Acta Materialia, 120, pp. 364-378, (2016)

[19] Balasubramanian G, Puri I K., Heat conduction across a solid-solid interface: Understanding nanoscale interfacial effects on thermal resistance, Applied Physics Letters, 99, 1, (2011)

[20] Gao Y F, Meng Q Y., Molecular dynamics simulation on thermal conductivity of one dimenison nanomaterials[J], Acta Metallurgica Sinica, 46, 10, pp. 1244-1249, (2010)

[11] Ide E, Angata S, Hirose A, Et al., Metal–metal bonding process using Ag metallo-organic nanoparticles, Acta Materialia, 53, 8, pp. 2385-2393, (2005)

[12] Bai J G, Zhiye Z Z, Calata J N, Et al., Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material[J], IEEE Transactions on Components and Packaging Technologies, 29, 3, pp. 589-593, (2006)

[13] He Xiaobin, Molecular dynamics simulation of metal nanowire connections, (2013)

[14] Wu Mao, Chang Lingling, Cui Yanan, Molecular dynamics simulation of the melting and sintering process of gold nanoparticles, Powder Metallurgy Materials Science and Engineering, 18, 6, pp. 775-782, (2013)

[15] Suzuki T, Terasaki T, Kawana Y, Et al., Effect of manufacturing process on micro-deformation behavion of sintered-silver dia-attach material[J], IEEE Transactions on Device and Material Reliability, 16, pp. 588-596, (2016)

[16] Jiang Shan, Zhang Yuwen, Hao Peng, Molecular dynamics study of neck growth in laser sintering of hollow silver nanoparticles with different heating rates, Journal of Physics D:Applied Physics, 46, (2013)

[17] Wang Xin, Lu Dan, Shen Shengping, Non-equilibrium molecular dynamics study of the thermal conductivity of Ni/Al laminated structures, Science China: Physics, Mechanics & Astronomy, 44, pp. 506-513, (2014)

[18] Lange A P, Samanta A, Majidi H, Et al., Dislocation mediated alignment during metal nanoparticle Coalescence[J], Acta Materialia, 120, pp. 364-378, (2016)

[19] Balasubramanian G, Puri I K., Heat conduction across a solid-solid interface: Understanding nanoscale interfacial effects on thermal resistance, Applied Physics Letters, 99, 1, (2011)

[20] Gao Y F, Meng Q Y., Molecular dynamics simulation on thermal conductivity of one dimenison nanomaterials[J], Acta Metallurgica Sinica, 46, 10, pp. 1244-1249, (2010)