Molecular dynamics simulation study of sintering mechanism and thermal conductivity of nano-Ag particles

[1] Chen Hongtao, Hu Tianqi, Li Mingyu, Cu@Sn core–shell structure powder preform for high-temperature applications based on transient liquid phase bonding, IEEE Transactions on Power Electronics, 32, 1, pp. 441-451, (2017)

[2] Yang Dongsheng, Zhang He, Tian Yanhong, Et al., Progress in the study of micro-nano connection technology, i. e. failure behaviour, in electronic packaging, Transactions of the China Welding Institution, 43, 11, pp. 126-136, (2022)

[3] Zhong Ying, An Rong, Wang Chunqing, Low temperature sintering Cu₆Sn₅ nanoparticles for superplastic and super-uniform high temperature circuit interconnections, Small, 11, 33, pp. 4097-4103, (2015)

[4] Liu Hao, Ma Rui, Wang Jianqiang, Et al., Application of silver nanoparticles in electrically conductive adhesives with silver micro flakes[J], China Welding, 31, 1, pp. 23-28, (2022)

[5] Li Hong, Yuan Junli, Li Zhuoxin, Advances in molecular dynamics simulation of nano-connectivity processes, Chinese Journal of Mechanical Engineering, 30, 4, pp. 486-493, (2019)

[6] Pei Chun, A spatial point process based simulation prediction method for equivalent elastic modulus of silver paste solder layers, Electronic Components & Materials, 39, 6, pp. 80-83, (2020)

[7] Carr J, Milhert X, Gadaud P, Et al., Quantitative characterization of porosity and determination of elastic modules for sintered micro-silver joints, Journal of Materials Processing Technology, 225, pp. 19-23, (2015)

[8] Liu Yanli, Numerical simulation of chip interconnect sintering tissue properties based on hole characteristics, (2021)

[9] Wang M, Mei Y, Li X, Et al., Die-attach on nickel substrate by pressureless sintering a trimodal silver paste, Materials Letters, 253, pp. 131-135, (2019)

[10] Li M, Xiao Y, Zhang Z, Et al., Bimodal sintered silver nanoparticle paste with ultrahigh thermal conductivity and shear strength for high temperature thermal interface material applications, ACS Applied Materials & Interfaces, 7, 17, pp. 9157-9168, (2015)

[1] Chen Hongtao, Hu Tianqi, Li Mingyu, Cu@Sn core–shell structure powder preform for high-temperature applications based on transient liquid phase bonding, IEEE Transactions on Power Electronics, 32, 1, pp. 441-451, (2017)

[2] Yang Dongsheng, Zhang He, Tian Yanhong, Et al., Progress in the study of micro-nano connection technology, i. e. failure behaviour, in electronic packaging, Transactions of the China Welding Institution, 43, 11, pp. 126-136, (2022)

[3] Zhong Ying, An Rong, Wang Chunqing, Low temperature sintering Cu₆Sn₅ nanoparticles for superplastic and super-uniform high temperature circuit interconnections, Small, 11, 33, pp. 4097-4103, (2015)

[4] Liu Hao, Ma Rui, Wang Jianqiang, Et al., Application of silver nanoparticles in electrically conductive adhesives with silver micro flakes[J], China Welding, 31, 1, pp. 23-28, (2022)

[5] Li Hong, Yuan Junli, Li Zhuoxin, Advances in molecular dynamics simulation of nano-connectivity processes, Chinese Journal of Mechanical Engineering, 30, 4, pp. 486-493, (2019)

[6] Pei Chun, A spatial point process based simulation prediction method for equivalent elastic modulus of silver paste solder layers, Electronic Components & Materials, 39, 6, pp. 80-83, (2020)

[7] Carr J, Milhert X, Gadaud P, Et al., Quantitative characterization of porosity and determination of elastic modules for sintered micro-silver joints, Journal of Materials Processing Technology, 225, pp. 19-23, (2015)

[8] Liu Yanli, Numerical simulation of chip interconnect sintering tissue properties based on hole characteristics, (2021)

[9] Wang M, Mei Y, Li X, Et al., Die-attach on nickel substrate by pressureless sintering a trimodal silver paste, Materials Letters, 253, pp. 131-135, (2019)

[10] Li M, Xiao Y, Zhang Z, Et al., Bimodal sintered silver nanoparticle paste with ultrahigh thermal conductivity and shear strength for high temperature thermal interface material applications, ACS Applied Materials & Interfaces, 7, 17, pp. 9157-9168, (2015)