Removal Mechanism and Effect of Parameters on Grinding Force in Grinding SiC Ceramics

被引：0

作者：

Zhou Y.-G. ^{[1
,2
,3
]}

Tian C.-C. ^{[1
]}

Wang S.-H. ^{[1
]}

Chen H. ^{[1
]}

机构：

[1] School of Mechanical Engineering & Automation, Northeastern University, Shenyang

[2] AVIC SAC Commercial Aircraft Company Ltd., Shenyang

[3] Qinhuangdao Ruifang Machinery Company Limited, Qinhuangdao

来源：

Dongbei Daxue Xuebao/Journal of Northeastern University | 2024年 / 45卷 / 04期

关键词：

grinding; grinding force; removal mechanism; SiC ceramics; SPH;

D O I：

10.12068/j.issn.1005-3026.2024.04.012

中图分类号：

学科分类号：

摘要：

In order to explore the removal mechanism and influence law of grinding force in grinding SiC ceramics，the simulation model of single abrasive striking SiC ceramics was established based on the SPH（smoothed particle hydrodynamics） method，and the crack generation and propagation mechanism during grinding SiC ceramics were analyzed；the effect of grinding velocity（vs），feeding rate（vw）and grinding depth（ap）on the removal mechanism，the normal grinding force and tangential grinding force of grinding SiC ceramics were analyzed by the single factor experiment. The results showed that the abrasives striking the workpiece lead to the generation of the median cracks and the transverse cracks. With the increase of abrasive pressing depth，the transverse crack expands to the material surface，and when the transverse crack expands to the material surface，the brittle fracture occurs. With the increase of vs，the decrease of vw and ap，and the decrease of the area and depth of the pits on the grinding surface，the plastic removal area becomes larger，and the normal grinding force and tangential grinding force both decrease. These results may provide an important basis for high‐efficiency and low-damage machining of SiC ceramic components. © 2024 Northeast University. All rights reserved.

引用

页码：548 / 554

页数：6

共 12 条

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