Surface Particles of 200 mm Heavily Doped Silicon Wafer before APCVD Process with Dopants
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Han, Ping
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General Research Institute for Nonferrous Metals, Beijing,100088, China
GRINM Semiconductor Materials Co., Ltd., Beijing,100088, ChinaGeneral Research Institute for Nonferrous Metals, Beijing,100088, China
Han, Ping
[1
,2
]
Qu, Xiang
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GRINM Semiconductor Materials Co., Ltd., Beijing,100088, ChinaGeneral Research Institute for Nonferrous Metals, Beijing,100088, China
Qu, Xiang
[2
]
Zhou, Qigang
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机构:
General Research Institute for Nonferrous Metals, Beijing,100088, China
GRINM Semiconductor Materials Co., Ltd., Beijing,100088, ChinaGeneral Research Institute for Nonferrous Metals, Beijing,100088, China
Zhou, Qigang
[1
,2
]
Xiao, Qinghua
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GRINM Semiconductor Materials Co., Ltd., Beijing,100088, ChinaGeneral Research Institute for Nonferrous Metals, Beijing,100088, China
Xiao, Qinghua
[2
]
Liu, Bin
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GRINM Semiconductor Materials Co., Ltd., Beijing,100088, ChinaGeneral Research Institute for Nonferrous Metals, Beijing,100088, China
Liu, Bin
[2
]
He, Yu
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机构:
GRINM Semiconductor Materials Co., Ltd., Beijing,100088, ChinaGeneral Research Institute for Nonferrous Metals, Beijing,100088, China
He, Yu
[2
]
机构:
[1] General Research Institute for Nonferrous Metals, Beijing,100088, China
[2] GRINM Semiconductor Materials Co., Ltd., Beijing,100088, China