Curing Reaction Kinetics and Properties of Epoxy Terminated Silicon Oxide/Epoxy Resin/Bismaleimides

被引:0
作者
Yang J. [1 ]
Jia Y. [1 ]
Ma W. [1 ]
Sun P. [1 ]
机构
[1] College of Chemical Engineering, Xi'an University, Xi'an
来源
Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering | 2021年 / 37卷 / 06期
关键词
Bismaleimide resin; Curing reaction kinetics; Epoxy resin; Heat resistance properties; Silicon dioxide with epoxy terminated;
D O I
10.16865/j.cnki.1000-7555.2021.0164
中图分类号
学科分类号
摘要
To endow the bismaleimide (BMI) resins with higher heat resistance and mechanical properties, the silicon dioxide with terminal epoxy groups(E-SiO2) was prepared via sol-gel process using ethyl orthosilicate (TEOS) and 3-epoxide methoxypropyltrimethoxysilane (KH-560) with terminal epoxy groups as precursor and silane coupling agent, respectively, and the curing process of BMI was also optimized. E-SiO2/EP/BMI composites with excellent comprehensive performance were fabricated using E-SiO2 as nano-filler and epoxy resin (EP) as organic moification system by the copolymerization of BMI. It is found that the curing reaction kinetics of BMI resin are affected by the addition of E-SiO2 and EP. The results show that, compared with the pure BMI resin, the gel time of the E-SiO2/EP/BMI resin system is shortened from 19 min to 4 min with the addition of 4.0% E-SiO2 and 10.0% EP, but the apparent activation energy changes little. The bending strength of the material is increased from 125.53 MPa to 182.14 MPa, increased by 32.3%, while it also exhibits a better heat resistance before 500℃. © 2021, Editorial Board of Polymer Materials Science & Engineering. All right reserved.
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页码:34 / 42
页数:8
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