F5: Enabling New System Architectures with 2.5D, 3D, and Chiplets

被引：0
|
作者：
Gonzalez, Christopher [1 ]
Liu, Huichu [2 ]
Noh, Mijung [3 ]
Karl, Eric [4 ]
Toifl, Thomas [5 ]
Hsu, Shawn [6 ]
机构：
[1] Ibm, Yorktown Heights,NY, United States
[2] Facebook, Menlo Park,CA, United States
[3] Samsung Electronics, Hwaeong-si, Gyeonggi-do, Korea, Republic of
[4] Intel, Portland,OR, United States
[5] Cisco Systems, Wallisellen, Switzerland
[6] National Tsing Hua Univeristy, Hsinchu, Taiwan
来源：
Digest of Technical Papers - IEEE International Solid-State Circuits Conference | 2021年 / 64卷
关键词：
D O I：
10.1109/ISSCC42613.2021.9365834
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学科分类号：
摘要：
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页码：529 / 532
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