Development of Active-Ester Type Epoxy Resin Curing Agents for the Printed Wiring Boards of High-Speed Communication Devices

被引：0

作者：

Arita, Kazuo ^{[1
]}

Suzuki, Etsuko ^{[1
]}

Shimono, Tomohiro ^{[2
]}

Okamoto, Tatsuya ^{[2
]}

Idemura, Satoshi ^{[1
]}

Yamada, Masao ^{[2
]}

Fujimoto, Kouichi ^{[2
]}

机构：

[1] DIC Corporation, Central Research Laboratories, 631, Sakado, Chiba, Sakura,285-8668, Japan

[2] DIC Corporation, Chiba Plant, 12, Yawata-kaigandori, Chiba, Ichihara,290-8585, Japan

来源：

Journal of Japan Institute of Electronics Packaging | 2022年 / 25卷 / 06期

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D O I：

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学科分类号：

摘要：

5G mobile communication systems - Curing - Dielectric devices - Dielectric losses - Dielectric materials - Electronics packaging - Esters - Glass - Glass transition - Heat resistance - Temperature

引用

页码：614 / 625