Molecular dynamics simulation of atomic-scale material removal processes by an abrasive grain

被引：0
作者：
Shimizu J.
机构：
来源：
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering | 2019年 / 85卷 / 04期
基金：
日本学术振兴会;
关键词：
Abrasive grain; Friction; Grinding; Interatomic potential; Molecular dynamics; Removal; Simulation; Sliding; Stick-slip;
D O I：
10.2493/jjspe.85.314
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：314 / 317
页数：3
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