Study on Surface Corrosion and Wear Performance of Single-crystal SiC Based on Metal Electrochemical Corrosion

被引:0
作者
Hu D. [1 ,2 ]
Lu J. [1 ,2 ]
Yan Q. [1 ,2 ]
Luo Y. [1 ,2 ]
Luo Z. [1 ,2 ]
机构
[1] School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou
[2] State Key Laboratory for High-Performance Tools, Guangzhou
来源
Hunan Daxue Xuebao/Journal of Hunan University Natural Sciences | 2024年 / 51卷 / 04期
基金
中国国家自然科学基金;
关键词
chemical mechanical polishing; corrosion performance; metal electrochemical corrosion; single-crystal SiC; wear performance;
D O I
10.16339/j.cnki.hdxbzkb.2024178
中图分类号
学科分类号
摘要
Aiming at the environmental pollution of the polishing solution in chemical mechanical polishing,a single-crystal SiC chemical mechanical polishing method based on metal electrochemical corrosion is proposed. The Si surface of single-crystal SiC corrosion performance and wear performance of electrochemically corroded were investigated by corrosion experiments and wear experiments. By comparing the corrosion performance of Al,Cu,and Fe metals on the Si face in a Na2SO4 electrolyte solution,it was found that only Al can generate a noticeable corrosion layer. The EDS and XPS analyses of the Si face confirmed that the corrosion is due to the formation of the SiO2 layer. Frictional wear experiments were conducted to investigate the influence of solution composition on the wear behavior of Si face. Increasing the concentration of the Na2SO4 electrolyte solution resulted in higher wear,with a maximum wear value of 7.19 μm2 obtained in 1.00 mol/L Na2SO4 electrolyte solution. In an acidic corrosive solution,the Si face exhibited the highest material removal,with a wear value of 11.97 μm2 achieved at pH=3. The material removal mechanism of single-crystal SiC via metal electrochemical corrosion involved the corrosive reaction involving Al at the cathode,which generated a corrosion current,and the subsequent oxidation of the SiC surface at the anode,thereby forming a SiO2 oxide layer leading to material removal. © 2024 Hunan University. All rights reserved.
引用
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页码:123 / 131
页数:8
相关论文
共 28 条
[1]  
YIN X C, LI S J, CHAI P., Investigation of SiC single crystal polishing by combination of anodic oxidation and mechanical polishing[J], International Journal of Electrochemical Science, 15, 5, pp. 4388-4405, (2020)
[2]  
SETERA B, CHRISTOU A., Challenges of overcoming defects in wide bandgap semiconductor power electronics, Electronics, 11, 1, (2021)
[3]  
ANDERSON C P, BOURASSA A, MIAO K C, Et al., Electrical and optical control of single spins integrated in scalable semiconductor devices, Science, 366, 6470, pp. 1225-1230, (2019)
[4]  
RACKA-SZMIDT K, STONIO B, ZELAZKO J, Et al., A review: inductively coupled plasma reactive ion etching of silicon carbide [J], Materials, 15, 1, (2022)
[5]  
IANNACCONE G, SBRANA C, MORELLI I, Et al., Power electronics based on wide-bandgap semiconductors:opportunities and challenges[J], IEEE Access, 9, pp. 139446-139456, (2021)
[6]  
AIDA H, DOI T, TAKEDA H, Et al., Ultraprecision CMP for sapphire,GaN,and SiC for advanced optoelectronics materials [J], Current Applied Physics, 12, pp. S41-S46, (2012)
[7]  
SEO J., A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization[J], Journal of Materials Research, 36, 1, pp. 235-257, (2021)
[8]  
WANG Q, YIN D, GAO B H, Et al., Effect of arginine-based cleaning solution on BTA residue removal after Cu-CMP[J], Colloids and Surfaces A:Physicochemical and Engineering Aspects, 586, (2020)
[9]  
HONG J, NIU X H, LIU Y L, Et al., Effect of a novel chelating agent on defect removal during post-CMP cleaning[J], Applied Surface Science, 378, pp. 239-244, (2016)
[10]  
LIU L, ZHANG Z Y, WU B, Et al., A review:green chemical mechanical polishing for metals and brittle wafers[J], Journal of Physics D:Applied Physics, 54, 37, (2021)