Low-temperature direct bonding of diamond (100) substrate on Si wafer under atmospheric conditions

被引：0

作者：

Matsumae, Takashi ^{[1
]}

Kurashima, Yuichi ^{[1
]}

Takagi, Hideki ^{[1
]}

Umezawa, Hitoshi ^{[2
]}

Higurashi, Eiji ^{[1
]}

机构：

[1] National Institute of Advanced Industrial Science and Technology (AIST), Device Technology Research Institute, 1-2-1 Namiki, Tsukuba, Ibaraki,305-8564, Japan

[2] National Institute of Advanced Industrial Science and Technology (AIST), Advanced Power Electronics Research Center (ADPERC), 1-8-31 Midoriokai, Ikeda, Osaka,563-8577, Japan

来源：

Scripta Materialia | 2022年 / 191卷

关键词：

25;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：52 / 55