Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate

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作者：
Wu, Y. [1 ]
Huang, M.L. [1 ]
机构：
[1] Electronic Packaging Materials Laboratory, School of Materials Science & Engineering, Dalian University of Technology, Dalian,116024, China
来源：
Journal of Alloys and Compounds | 2021年 / 858卷
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