Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate

被引：0
|
作者：
Wu, Y. [1 ]
Huang, M.L. [1 ]
机构：
[1] Electronic Packaging Materials Laboratory, School of Materials Science & Engineering, Dalian University of Technology, Dalian,116024, China
来源：
Journal of Alloys and Compounds | 2021年 / 858卷
关键词：
26;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate
    Wu, Y.
    Huang, M. L.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 858
  • [2] Obstructed Growth of Interfacial Intermetallic Compounds on (011) and (111)-Oriented Nanotwinned Cu Substrates
    Zhan, Lixin
    Wu, Yang
    Zhang, Shinan
    Huang, Mingliang
    2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
  • [3] Grain growth in electroplated (111)-oriented nanotwinned Cu
    Huang, Yi-Sa
    Liu, Chien-Min
    Chiu, Wei-Lan
    Chen, Chih
    SCRIPTA MATERIALIA, 2014, 89 : 5 - 8
  • [4] Interfacial enhancement of Ag and Cu particles sintering using(111)-oriented nanotwinned Cu as substrate for die-attachment
    郭如梦
    肖宇博
    高悦
    周士祺
    刘洋
    刘志权
    China Welding, 2022, 31 (01) : 22 - 28
  • [5] Thermal and compositional fields to maneuver Cu 6 Sn 5 intermetallic growth on (111) nanotwinned copper substrate
    Zhang, Zhijie
    Wei, Hong
    Gao, Xing
    Kunwar, Anil
    JOURNAL OF ALLOYS AND COMPOUNDS, 2024, 998
  • [6] Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu
    Chien-Min Liu
    Han-Wen Lin
    Chia-Ling Lu
    Chih Chen
    Scientific Reports, 4
  • [7] Electrodeposition of (111)-oriented nanotwinned Cu in Damascene vias
    Sun, Hai-Tao
    Gao, Li-Yin
    Ma, Yong-Hui
    Liu, Zhi-Quan
    2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
  • [8] Communication-Growth of <111> Nanotwinned Nickel Films on <111> Nanotwinned Cu Substrates
    Chu, Yi-Cheng
    Chen, Chih
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2017, 6 (10) : P715 - P717
  • [9] Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
    Hsiao, Hsiang-Yao
    Liu, Chien-Min
    Lin, Han-Wen
    Liu, Tao-Chi
    Lu, Chia-Ling
    Huang, Yi-Sa
    Chen, Chih
    Tu, K. N.
    SCIENCE, 2012, 336 (6084) : 1007 - 1010
  • [10] Mechanical properties of highly (111)-oriented nanotwinned Cu lines
    Lai, Wei-Ling
    Chen, Chih
    2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016), 2016, : 220 - 222
12345