Modeling and Simulation of a Hybrid Jet-Impingement/Micro-Channel Heat Sink

被引:1
作者
Xu T. [1 ,2 ]
Liu H. [2 ]
Zhang D. [1 ,2 ]
Li Y. [2 ]
Zhou X. [2 ]
机构
[1] Research Institute of CSIC, Nanjing
[2] University of Electronic Science and Technology of China, Chengdu
来源
Zhou, Xiaoming (zhouxm@uestc.edu.cn) | 1600年 / Tech Science Press卷 / 17期
基金
中国国家自然科学基金;
关键词
heat sink; Jet impingement; micro-channel; numerical simulation; orthogonal test;
D O I
10.32604/fdmp.2021.010608
中图分类号
学科分类号
摘要
With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit, new strategies are needed to extract heat from these devices in an efficient way. In this regard methods based on the combination of the so-called “jet impingement” and “micro-channel” approaches seem extremely promising for possible improvement and future applications in electronics as well as the aerospace and biomedical fields. In this paper, a hybrid heat sink based on these two technologies is analysed in the frame of an integrated model. Dedicated CFD simulation of the coupled flow/temperature fields and orthogonal tests are performed in order to optimize the overall design. The influence of different sets of structural parameters on the cooling performance is examined. It is shown that an optimal scheme exists for which favourable performance can be obtained in terms of hot spot temperature decrease and thermal uniformity improvement. © 2021. This work is licensed under a Creative Commons Attribution 4.0 International License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
引用
收藏
页码:109 / 121
页数:12
相关论文
共 28 条
[1]  
Ebadian M. A., Lin C. X., A review of high heat flux heat removal technologies, Journal of Heat Transfer-Transactions of the ASME, 133, 11, (2011)
[2]  
Sohel Murshed S. M., Nieto de Castro C. A., A critical review of traditional and emerging techniques and fluids for electronics cooling, Renewable and Sustainable Energy Reviews, 78, pp. 821-833, (2017)
[3]  
Yu C. Y., Yu X. Z., Preliminary study on electronic equipment thermal analysis/thermal design/thermal test technology, Microelectronics, 30, 5, pp. 334-337, (2000)
[4]  
Mackowski M. J., Requirements for high flux cooling of future avionics systems, Aerospace Technology Conference and Exposition, (1991)
[5]  
Ge Z. J., Gu Y. X., Wang H. W., Finite element numerical simulation analysis of thermal loads on electronic packages, Journal of Dalian University of Technology, 45, 5, pp. 320-325, (2005)
[6]  
Zhou X. M., Shu Z. Q., Liang X. M., Jiang C. J., Su Y. C., Et al., Investigation on the thermal performance of a novel micro-channel-aided device for vitrification of cells/tissues, Applied Thermal Engineering, 119, 5, pp. 189-196, (2017)
[7]  
Zhou X. M., Qiao W. T., Zhang X. L., Liu Z., Gao D. Y., Physical modeling of flow boiling in microchannels and its induced vitrification of biomaterials, International Journal of Heat and Mass Transfer, 83, pp. 659-664, (2015)
[8]  
Sung M. K., Mudawar I., Single-phase and two-phase heat transfer characteristics of low temperature hybrid micro-channel/micro-jet impingement cooling module, International Journal of Heat and Mass Transfer, 51, 15–16, pp. 3882-3895, (2008)
[9]  
Asadi M., Xie G. N., Sunden B., A review of heat transfer and pressure drop characteristics of single and two-phase microchannels, International Journal of Heat and Mass Transfer, 79, pp. 34-53, (2014)
[10]  
Naqiuddin N. H., Saw L. H., Yew M. C., Yusof F., Ng T. C., Et al., Overview of micro-channel design for high heat flux application, Renewable and Sustainable Energy Reviews, 82, 1, pp. 901-914, (2018)