Effect of inhomogeneous characteristic structure on creep aging forming in Al-Cu-Li alloy thick plates

被引:0
|
作者
Zhang J. [1 ,2 ]
Zheng C.-J. [1 ]
Chen M.-A. [1 ,2 ]
机构
[1] Research Institute of Light Alloy, Central South University, Changsha
[2] State Key Laboratory of High Performance and Complex Manufacturing, Central South University, Changsha
关键词
Al-Cu-Li alloy; Creep aging forming; Microstructure; Thick plate;
D O I
10.11817/j.ysxb.1004.0609.2022-36679
中图分类号
学科分类号
摘要
The effect of inhomogeneous structure on creep aging process of Al-Cu-Li alloy thick plate was studied by uniaxial constant stress creep test, electron backscatter diffraction (EBSD) and transmission electron microscope (TEM) techniques. The results show that the difference of the thick-direction inhomogeneous structures exhibits obvious different creep deformation behavior, and the characteristic structure near the center layer has a higher creep and a faster initial creep rate. There is no definite correlation between the grain size of the characteristic structure of the thick plate and the creep deformation, and the dislocation movement is the main factor affecting the creep. The grain size changes slightly before and after creep aging, but the proportion of small-angle grain boundaries increases to a varying degree after creep aging. In addition, the different characteristic microstructures of the thick plate could affect the precipitation behavior of the strengthening phase T1 during the creep aging process. The characteristic structure near the center layer forms more dislocation entanglements during the creep process, which promotes a large number of precipitation and dense distribution of T1 phase. © 2022, China Science Publishing & Media Ltd. All right reserved.
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页码:1889 / 1899
页数:10
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