Introduction of Multi-Wiring Board Suitable for SDGs

被引：0
|
作者：
Wakabayashi, Akihiko [1 ]
机构：
[1] Technology Development and Design Dept., Lincstech Co., Ltd., 1500, Ogawa, Ibaraki, Chikusei-shi,308-8521, Japan
来源：
Journal of Japan Institute of Electronics Packaging | 2022年 / 25卷 / 03期
关键词：
Compendex;
D O I：
10.5104/jiep.25.191
中图分类号：
学科分类号：
摘要：
引用
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页码：191 / 195
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