共 77 条
[1]
Meng B., Zhang F., Li Z., Deformation and removal characteristics in nanoscratching of 6H-SiC with Berkovich indenter, Materials Science in Semiconductor Processing, 31, pp. 160-165, (2015)
[2]
Diebold A., Jia Z., Graumann I.J., Et al., High-power Yb: GGG thin-disk laser oscillator: First demonstration and power-scaling prospects, Optics Express, 25, 2, pp. 1452-1462, (2017)
[3]
Shi Y., Chen Q.W., Shi J.L., Processing and scintillation properties of Eu<sub>3</sub>+ doped Lu<sub>2</sub>O<sub>3</sub> transparent ceramics, Optical Materials, 31, 5, pp. 729-733, (2009)
[4]
Bastawros A.F., Chandra A., Poosarla P.A., Atmospheric pressure plasma enabled polishing of single crystal sapphire, CIRP Annals, 64, 1, pp. 515-518, (2015)
[5]
Nakagomi S., Momo T., Takahashi S., Et al., Deep ultraviolet photodiodes based on β-Ga2O3/SiC heterojunction, Applied Physics Letters, 103, 7, (2013)
[6]
Cheng J., Gong Y., Experimental study of surface generation and force modeling in micro-grinding of single crystal silicon considering crystallographic effects, International Journal of Machine Tools and Manufacture, 77, pp. 1-15, (2014)
[7]
Miyashita M., 1st annual precision engineering conference, (1985)
[8]
King R.F., Tabor D., The strength properties and frictional behavior of brittle solids, Proceedings of the Royal Society of London A: Mathematical, Physical and Engineering Sciences, 223, 1153, pp. 225-238, (1954)
[9]
Huerta M., Malkin S., Grinding of glass: The mechanics of the process, Journal of Engineering for Industry, 98, 2, pp. 459-467, (1976)
[10]
Molloy P., Schinker M.G., Doll W., Brittle fracture mechanisms in single point glass abrasion, Hague International Symposium, pp. 81-88, (1987)