Research Progress of Ductile Removal Mechanism for Hard-brittle Single Crystal Materials

被引:0
作者
Li C. [1 ]
Zhang F. [1 ]
Zhang X. [1 ]
Rao X. [1 ]
机构
[1] School of Mechatronics Engineering, Harbin Institute of Technology, Harbin
来源
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2019年 / 55卷 / 03期
关键词
Amorphous; Dislocation slip; Ductile removal mechanism; Hard-brittle single crystal materials; Phase transformation; Poly-crystalline nano-crystallites;
D O I
10.3901/JME.2019.03.181
中图分类号
学科分类号
摘要
In recent years, hard-brittle single crystal materials are wildly used in optics, aerospace, electronics, solid-state laser and other fields due to their high hardness, low density, low thermal expansion coefficient, chemical stability and other characteristics. However, these materials are typical difficult-to-machine materials and brittle-fracture is easily induced in machining process due to their high hardness and low fracture toughness. The ductile-regime machining of hard-brittle single crystal materials has become a hot researching topic in the field of ultra-precision machining. However, the research on ductile removal mechanism of these materials is still in the exploratory stage. The concept of ductile removal for hard-brittle single crystal materials is introduced, the research progress of the ductile removal mechanism for hard-brittle single crystal materials is summarized, the existing problems in the research of ductile removal mechanism of hard-brittle single crystal materials is pointed out, and the future research direction of the ductile removal mechanism for hard-brittle single crystal materials is prospected. © 2019 Journal of Mechanical Engineering.
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页码:181 / 190
页数:9
相关论文
共 77 条
[1]  
Meng B., Zhang F., Li Z., Deformation and removal characteristics in nanoscratching of 6H-SiC with Berkovich indenter, Materials Science in Semiconductor Processing, 31, pp. 160-165, (2015)
[2]  
Diebold A., Jia Z., Graumann I.J., Et al., High-power Yb: GGG thin-disk laser oscillator: First demonstration and power-scaling prospects, Optics Express, 25, 2, pp. 1452-1462, (2017)
[3]  
Shi Y., Chen Q.W., Shi J.L., Processing and scintillation properties of Eu<sub>3</sub>+ doped Lu<sub>2</sub>O<sub>3</sub> transparent ceramics, Optical Materials, 31, 5, pp. 729-733, (2009)
[4]  
Bastawros A.F., Chandra A., Poosarla P.A., Atmospheric pressure plasma enabled polishing of single crystal sapphire, CIRP Annals, 64, 1, pp. 515-518, (2015)
[5]  
Nakagomi S., Momo T., Takahashi S., Et al., Deep ultraviolet photodiodes based on β-Ga2O3/SiC heterojunction, Applied Physics Letters, 103, 7, (2013)
[6]  
Cheng J., Gong Y., Experimental study of surface generation and force modeling in micro-grinding of single crystal silicon considering crystallographic effects, International Journal of Machine Tools and Manufacture, 77, pp. 1-15, (2014)
[7]  
Miyashita M., 1st annual precision engineering conference, (1985)
[8]  
King R.F., Tabor D., The strength properties and frictional behavior of brittle solids, Proceedings of the Royal Society of London A: Mathematical, Physical and Engineering Sciences, 223, 1153, pp. 225-238, (1954)
[9]  
Huerta M., Malkin S., Grinding of glass: The mechanics of the process, Journal of Engineering for Industry, 98, 2, pp. 459-467, (1976)
[10]  
Molloy P., Schinker M.G., Doll W., Brittle fracture mechanisms in single point glass abrasion, Hague International Symposium, pp. 81-88, (1987)