Growth of Six Inches SiC Single Crystals Without Micropipe Defect

被引:0
作者
Zhang F. [1 ]
Yang K. [1 ]
Liu X. [1 ]
Lu Y. [1 ]
Niu X. [1 ]
Shang Y. [1 ]
Li T. [1 ]
机构
[1] Hebei Synlight Crystal Co., Ltd, Baoding
来源
Kuei Suan Jen Hsueh Pao/Journal of the Chinese Ceramic Society | 2021年 / 49卷 / 04期
关键词
4H-silicon carbide single crystals; Micropipe closing; Micropipe defect;
D O I
10.14062/j.issn.0454-5648.20200508
中图分类号
学科分类号
摘要
The micropipe (MP) in silicon carbide (SiC) single crystal substrate is a fatal defect for SiC-based devices, which will seriously affect the yield of SiC power devices. In this paper, the 6 in n-type 4H-SiC single crystals without micropipe defect were prepared by the optimized growth design based on physical vapor transport (PVT) method. The effects of the optimized growth design on the elimination of micropipes were also studied. Based on the principle of crystallography and kinetics, the mechanism of micropipe decomposition and closing is clarified. In summary, the optimized growth design adopted in this paper not only promotes the stability of SiC single crystal growth, but also can improve the crystalline quality of SiC single crystal, and can quickly reduce the density of micropipes. The prepared large size 6 in n-type 4H-SiC single crystals without micropipe defect will be more suitable for making high-voltage and ultra-high-voltage power devices. © 2021, Editorial Department of Journal of the Chinese Ceramic Society. All right reserved.
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页码:736 / 742
页数:6
相关论文
共 23 条
[1]  
CASADY J, JOHNSON R W., Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review, Solid State Electron, 39, 10, pp. 1409-1422, (1996)
[2]  
SIERGIEJ R, CLARKE R, SRIRAM S, Et al., Advances in SiC materials and devices: an industrial point of view, Mater Sci Eng: B, 61, pp. 9-17, (1999)
[3]  
JI S, ZHANG Z, WANG F., Overview of high voltage SiC power semiconductor devices: Development and application, CES Transact Electr Syst, 1, 3, pp. 254-264, (2017)
[4]  
WANG F F, ZHANG Z., Overview of silicon carbide technology: Device, converter, system, and application, CPSS Transact Power Electr Appl, 1, 1, pp. 13-32, (2016)
[5]  
ZHU J, KIM H, CHEN H, Et al., High efficiency SiC traction inverter for electric vehicle applications, 2018 IEEE Appl Power Electr Conf Expos (APEC), pp. 1428-1433, (2018)
[6]  
NAKATANI K, YAMAGUCHI Y, KOMATSUZAKI Y, Et al., A Ka-band high efficiency doherty power amplifier MMIC using GaN-HEMT for 5G application, 2018 IEEE MTT-S International Microwave Workshop Series on 5G Hardware and System Technologies (IMWS-5G), pp. 1-3, (2018)
[7]  
LI H, ZHUO J, LI Y, Et al., A MMIC GaN Power Amplifier Design for 5G Communication System, 2019 IEEE 3rd Advanced Information Management, Communicates, Electronic and Automation Control Conference (IMCEC), pp. 1788-1791, (2019)
[8]  
WAHAB Q, ELLISON A, HENRY A, Et al., Influence of epitaxial growth and substrate-induced defects on the breakdown of 4H-SiC Schottky diodes, Appl Phys Lett, 76, 19, pp. 2725-2727, (2000)
[9]  
NEUDECK P G, POWELL J A., Performance limiting micropipe defects in silicon carbide wafers, Ieee Electr Dev L, 15, 2, pp. 63-65, (1994)
[10]  
BASCERI C, KHLEBNIKOV I, KHLEBNIKOV Y, Et al., Growth of micropipe-free single crystal silicon carbide (SiC) ingots via physical vapor transport (PVT), Materials science forum, 527, pp. 39-42, (2006)