Effect of composition and nanostructure on the mechanical properties and thermal stability of Zr100-xCux thin film metallic glasses

被引：0

作者：

Brognara, Andrea ^{[1
]}

Best, James P. ^{[1
]}

Djemia, Philippe ^{[2
]}

Faurie, Damien ^{[2
]}

Dehm, Gerhard ^{[1
]}

Ghidelli, Matteo ^{[1
,2
]}

机构：

[1] Max-Planck-Institut für Eisenforschung GmbH, Düsseldorf,40237, Germany

[2] Laboratoire des Sciences des Procédés et des Matériaux (LSPM), CNRS, Université Sorbonne Paris Nord, Villetaneuse,93430, France

来源：

Materials and Design | 2022年 / 219卷

关键词：

Atoms - Flexible electronics - Glass - Metallic glass - Metals - Tensile testing - Thermodynamic stability - Thin films;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Thin film metallic glasses (TFMGs) are a novel class of materials showing a mutual combination of large plastic deformation in tension (>10% strain) and superior yield strength up to ∼ 3.5 GPa, which make them ideal candidates for applications such as flexible electronics. Nevertheless, a clear relationship between the atomic structure and mechanical properties of TFMGs has not yet been achieved. In particular, the role of composition in determining a different local atomic order and the effect of nanostructure on TFMGs properties must be further investigated. In this work, the mechanical properties and thermal stability of several amorphous Zr100-xCux TFMGs with either compact or fine columnar nanostructure were studied. The mediating role of composition in controlling crystallization temperature and hardness is here reported, which was found to increase from 4.6 to 7.7 GPa with increasing Cu content from 26 to 76 at.%. Moreover, plastic behavior and fracture resistance are shown to be highly dependent on both composition and nanostructure, with the Cu-rich and homogeneous film able to withstand elongation up to 2% strain before crack initiation. These results underline how atomic structure changes induced by composition can effectively influence TFMG properties, while demonstrating an approach to tune their behavior for various technological applications. © 2022 The Authors

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