共 23 条
[1]
(2021)
[2]
Cao L., Wang J., Harden G., Ye H., Stillwell R., Hoffman A.J., Et al., Experimental characterization of impact ionization coefficients for electrons and holes in GaN grown on bulk GaN substrates, Applied Physics Letters, 112, (2018)
[3]
Cui H., Accelerated temperature cycle test and coffin-manson model for electronic packaging, Proceedings of the RAMS, pp. 556-560, (2005)
[4]
Deshpande A., Jiang Q., Dasgupta A., Becker U., Fatigue life of joint-scale SAC305 solder specimens in tensile and tensile and shear mode, Proceedings of the 18th IEEE intersociety conference on thermal and thermomechanical phenomena in electronic systems (ITherm), Las Vegas, NV, USA, pp. 1026-1029, (2019)
[5]
Garcia R., Et al.
[6]
(2014)
[7]
Standard J., (2020)
[8]
Standard J., (2022)
[9]
Ji D., Ercan B., Chowdhury S., Experimental determination of impact ionization coefficients of electrons and holes in gallium nitride using homojunction structures, Applied Physics Letter, 115, (2019)
[10]
Lall P., Shirgaokar A., Arunachalam D., Norris–Landzberg acceleration factors and Goldmann constants for SAC305 lead-free electronics, ASME Journal of Electronic Packaging, 134, 3, (2012)