Projecting GaN HEMTs lifetimes under typical stresses commonly observed in DC-DC converters

被引:0
作者
Zhang S. [1 ]
Gajare S. [1 ]
Garcia R. [1 ]
Huang S. [1 ]
Espinoza A. [1 ]
Gorgerino A. [1 ]
Zhang R. [1 ]
Pozo A. [1 ]
Strittmatter R. [1 ]
Lidow A. [1 ]
机构
[1] Efficient Power Conversion Corporation, El Segundo, 90245, CA
来源
Power Electronic Devices and Components | 2023年 / 6卷
关键词
DC-DC converters; Drain reliability; GaN; Gate reliability; HEMTs; Lifetime projection; Overvoltage robustness; Temperature cycling;
D O I
10.1016/j.pedc.2023.100051
中图分类号
学科分类号
摘要
DC-DC converters exist in virtually every application of modern power electronics. Due to small die size, low on-resistance, and low parasitic capacitance, GaN power devices offer superior conversion efficiency and record-setting power density. In this paper, test-to-fail methodology is adopted to investigate the intrinsic wear-out mechanisms such as would be experienced in common DC-DC converters. Devices are stressed under gate bias, drain bias, and temperature cycling individually. The lifetime of each stressor is therefore projected based on the physics-based model developed from test-to-fail and an understanding of the unique stress conditions in DC-DC converters. © 2023 Efficient Power Conversion Corporation
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