Preparation, microstructure and properties of copper based wire

被引：0
作者：
Song K.-X. [1 ,2 ]
Zhou Y.-J. [1 ,2 ]
Mi X.-J. [3 ]
Xiao Z. [4 ]
Cao J. [5 ]
Ding Y.-T. [6 ]
Wu B.-A. [7 ]
Feng C.-L. [8 ]
Li Z. [4 ]
Chen D.-B. [9 ]
Lyu C.-C. [10 ]
Hu Y. [6 ]
Ding Y. [6 ]
机构：
[1] School of Material Science and Engineering, Henan University of Science and Technology, Luoyang
[2] Provincial and Ministerial Co-construction Collaborative Innovation Center of Nonferrous New Materials and Advanced Processing Technology, Luoyang
[3] General Research Institute for Nonferrous Metals, Beijing
[4] School of Materials Science and Engineering, Central South University, Changsha
[5] School of Mechanical Engineering, Henan Polytechnic University, Jiaozuo
[6] School of Materials Science and Engineering, Lanzhou University of Technology, Lanzhou
[7] Chongqing Materials Research Institute Co., Ltd., Chongqing
[8] Henan Senger Materials Technology Co., Ltd., Jiaozuo
[9] Changzhou Hengfeng Special Conductor Co., Ltd., Changzhou
[10] Henan Youke Electronic Materials Co., Ltd., Jiyuan
[11] Zhejiang Tony Electronic Co., Ltd., Huzhou
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2020年 / 30卷 / 12期
基金：
中国国家自然科学基金;
关键词：
Cold mould vertical continuous casting; Continuous drawing; Copper based materials; Hot mould horizontal continuous casting; Surface coating; Wire;
D O I：
10.11817/j.ysxb.1004.0609.2020-39790
中图分类号：
学科分类号：
摘要：
The copper wires are widely used in integrated circuit bonding wire, audio and video transmission cable, active wiring harness of medical devices, and various electronic components. It is the key conductor material to ensure the stable transmission of system current and signal. Based on the preparation process of copper wire, this paper reviews the process characteristics of hot mold horizontal continuous casting and cold mold vertical continuous casting, and their relationship with the directional solidification structure of as-cast copper rod. The effects of process parameters such as continuous drawing, heat treatment, and surface coating on the characteristics of grain size, precipitated phase, surface coating, and bonding were discussed. Finally, the development trend of application field and equipment technology of copper based wire under the background of "new infrastructure construction" was prospected. © 2020, Science Press. All right reserved.
引用
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页码：2845 / 2874
页数：29
相关论文
共 91 条
[1]  
CUI Lun, JI Xiao-na, CHEN Xiao-ping, DING Li, Research and development of pure copper wires and copper-based materials with high strength and high conductivity, Chinese Journal of Rare Metals, 28, 5, pp. 917-920, (2004)
[2]  
LI Zhou, XIAO Zhu, JIANG Yan-bin, LEI Qian, XIE Jian-xin, Composition design, phase transition and fabrication of copper alloys with high strength and electrical conductivity, The Chinese Journal of Nonferrous Metals, 29, 9, pp. 2019-2049, (2019)
[3]  
WEN Shan, ChANG Li-li, ShANG Xing-jun, LI Sheng-li, Microstructure and properties of Cu-Ag alloy wire, The Chinese Journal of Nonferrous Metals, 25, 6, pp. 1655-1661, (2015)
[4]  
SONG Hui-fang, Feasibility analysis of Cu wires bonding in packaging, Electronics and Packaging, 12, 2, pp. 12-14, (2012)
[5]  
DING Yu-tian, CAO Jun, XU Guang-ji, KOU Sheng-zhong, HU Yong, Research and application of copper bonding wire in electronic packaging, Foundry Technology, 27, 9, pp. 971-974, (2006)
[6]  
WU Zi-ping, LI Jing-zhong, Applications of copper alloys wires and their production processes, Shanghai Nonferrous Metals, 29, 3, pp. 17-20, (2017)
[7]  
XING Jian-dong, Solidification theory, practice and application of metals, (1990)
[8]  
ATSUMI O., Continuous casting of ingots with smooth surface, GAO Ze-sheng, transl. Light Alloy Fabrication Technology, 1, pp. 1-2, (1980)
[9]  
ZHU Yu-jian, Developing new products with OCC process, Light Alloy Fabrication Technology, 19, 3, pp. 20-23, (1991)
[10]  
LI Li-sheng, Hot mold continuous casting of Cu Cr alloy, pp. 12-18, (2004)
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