3D-IC Design Challenges and Requirements

被引：0

作者：

Park, John ^{[1
]}

Adams, Sarah ^{[1
]}

机构：

[1] Cadence Design Systems

来源：

Advancing Microelectronics | 2022年 / 49卷 / 02期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：16 / 19

共 50 条

[41] High Productivity Thermal Compression Bonding for 3D-IC [J].

Asahi, Noboru ;

Miyamoto, Yoshinori ;

Nimura, Masatsugu ;

Mizutani, Yoshihito ;

Arai, Yoshiyuki .

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015), 2015,

[42] A Vertical Solenoid Inductor for Noise Coupling Minimization in 3D-IC [J].

Yahalom, Gilad ;

Wang, Alice ;

Ko, Uming ;

Chandrakasan, Anantha .

PROCEEDINGS OF THE 2015 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM (RFIC 2015), 2015, :55-58

[43] Low-temperature bonding technologies for MEMS and 3D-IC [J].

20143818167102 .

(1) SINTEF, Oslo, Norway; (2) STMicroelectronics Malta, Kirkop, Malta; (3) Besi Austria GmbH, Radfeld, Austria; (4) Fraunhofer EMFT, Munich, Germany; (5) University of Oslo, Oslo, Norway, 1600, Technology Society; The IEEE Components, Packaging, and Manufacturing (IEEE Computer Society)

[44] 3D-optimized SRAM Macro Design and Application to Memory-on-Logic 3D-IC at Advanced Nodes [J].

Chen, R. ;

Weckx, P. ;

Salahuddin, S. M. ;

Kim, S-W ;

Sisto, G. ;

Van der Plas, G. ;

Stucchi, M. ;

Baert, R. ;

Debacker, P. ;

Na, M. H. ;

Ryckaert, J. ;

Milojevic, D. ;

Beyne, E. .

2020 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2020,

[45] Solving 3D-IC Multiphysics Challenges With A Novel ML-Assisted Co-Optimization Methodology [J].

Lin, Lang ;

Zhang, Tianhao ;

Li, Qinglian ;

Yin, Lei ;

Chang, Norman .

2024 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI TSA, 2024,

[46] R&D of 3D-IC Technology through National Projects [J].

Kikuchi, Katsuya .

2022 IEEE INTERNATIONAL MEETING FOR FUTURE OF ELECTRON DEVICES, KANSAI, IMFEDK, 2022,

[47] A Cost-Aware Framework for Lifetime Reliability of TSV-Based 3D-IC Design [J].

Reddy, Raviteja P. ;

Acharyya, Amit ;

Khursheed, Saqib .

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2020, 67 (11) :2677-2681

[48] Leveraging 3D-IC for On-chip Timing Uncertainty Measurements [J].

Widialaksono, Randy ;

Zhao, Wenxu ;

Davis, W. Rhett ;

Franzon, Paul .

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2014,

[49] TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing [J].

Zhao, Yi ;

Hao, Cong ;

Yoshimura, Takeshi .

2018 28TH INTERNATIONAL SYMPOSIUM ON POWER AND TIMING MODELING, OPTIMIZATION AND SIMULATION (PATMOS), 2018, :155-162

[50] A Comparative Analysis of 3D-IC Partitioning Schemes for Asynchronous Circuits [J].

Caley, Landon ;

Lo, Chien-Wei ;

Sabado, Francis ;

Di, Jia .

2014 IEEE INTERNATIONAL CONFERENCE ON IC DESIGN & TECHNOLOGY (ICICDT), 2014,

← 1 2 3 4 5 →