3D-IC Design Challenges and Requirements

被引：0

作者：

Park, John ^{[1
]}

Adams, Sarah ^{[1
]}

机构：

[1] Cadence Design Systems

来源：

Advancing Microelectronics | 2022年 / 49卷 / 02期

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D O I：

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摘要：

引用

页码：16 / 19

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