3D-IC Design Challenges and Requirements

被引：0
|
作者：
Park, John [1 ]
Adams, Sarah [1 ]
机构：
[1] Cadence Design Systems
来源：
Advancing Microelectronics | 2022年 / 49卷 / 02期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：16 / 19
相关论文
共 50 条
  • [11] Enabling Faster Design/Performance Decisions for 3D-IC Package Architectures
    Varadharajan, Narayanan Terizhandur
    Ozen, Metin
    Koga, Kazunari
    Mandavia, Humair
    2017 THIRTY-THIRD ANNUAL SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM), 2017, : 63 - 69
  • [12] Optimization of the 3D-IC model structure
    Aralov, M. N.
    Barabanov, V. F.
    Kravets, O. Ja
    Nuzhny, A. M.
    Varlamov, N. V.
    2ND INTERNATIONAL TELECOMMUNICATION CONFERENCE ADVANCED MICRO- AND NANOELECTRONIC SYSTEMS AND TECHNOLOGIES, 2019, 498
  • [13] 3D-IC Technologies and 3D FPGA
    Wu, Xin
    2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015), 2015,
  • [14] Design of a 3D-IC Multi-Resolution Digital Pixel Sensor
    Brochard, N.
    Nebhen, J.
    Dubois, J.
    Ginhac, D.
    REAL-TIME IMAGE AND VIDEO PROCESSING 2016, 2016, 9897
  • [15] Paradigm changes in 3D-IC manufacturing
    Matthias, Thorsten
    Lindner, Paul
    SOLID STATE TECHNOLOGY, 2013, 56 (05) : 29 - +
  • [16] Unified 3D-IC Multi-Chiplet System Design Solution
    Lay, Wang-Tyng
    PROCEEDINGS OF THE 2024 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, ISPD 2024, 2024, : 83 - 83
  • [17] Electromigration Behavior of 3D-IC TSV Interconnects
    Frank, Thomas
    Moreau, Stephane
    Chappaz, Cedrick
    Arnaud, Lucile
    Leduc, Patrick
    Thuaire, Aurelie
    Anghel, Lorena
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 326 - 330
  • [18] 3D-IC Interconnect Test, Diagnosis, and Repair
    Chi, Chun-Chuan
    Wu, Cheng-Wen
    Wang, Min-Jer
    Lin, Hung-Chih
    2013 IEEE 31ST VLSI TEST SYMPOSIUM (VTS), 2013,
  • [19] A 3D-IC technology with integrated microchannel cooling
    Sekar, Deepak
    King, Calvin
    Dang, Bing
    Spencer, Todd
    Thacker, Hiren
    Joseph, Paul
    Bakir, Muhannad
    Meindl, James
    PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2008, : 13 - +
  • [20] Challenges and Improvements for 3D-IC Integration Using Ultra Thin (25μm) Devices
    La Manna, A.
    Buisson, T.
    Detalle, M.
    Rebibis, K. J.
    Velenis, D.
    Zhang, W.
    Beyne, E.
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 532 - 536
12345