3D-IC Design Challenges and Requirements

被引：0

作者：

Park, John ^{[1
]}

Adams, Sarah ^{[1
]}

机构：

[1] Cadence Design Systems

来源：

Advancing Microelectronics | 2022年 / 49卷 / 02期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：16 / 19

共 50 条

[11] Predictive AI for the 3D-IC Design Process Reduces the Iteration [J].

Sun, Julian .

2024 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI TSA, 2024,

[12] Enabling Faster Design/Performance Decisions for 3D-IC Package Architectures [J].

Varadharajan, Narayanan Terizhandur ;

Ozen, Metin ;

Koga, Kazunari ;

Mandavia, Humair .

2017 THIRTY-THIRD ANNUAL SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM), 2017, :63-69

[13] Optimization of the 3D-IC model structure [J].

Aralov, M. N. ;

Barabanov, V. F. ;

Kravets, O. Ja ;

Nuzhny, A. M. ;

Varlamov, N. V. .

2ND INTERNATIONAL TELECOMMUNICATION CONFERENCE ADVANCED MICRO- AND NANOELECTRONIC SYSTEMS AND TECHNOLOGIES, 2019, 498

[14] 3D-IC Technologies and 3D FPGA [J].

Wu, Xin .

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015), 2015,

[15] Design of a 3D-IC Multi-Resolution Digital Pixel Sensor [J].

Brochard, N. ;

Nebhen, J. ;

Dubois, J. ;

Ginhac, D. .

REAL-TIME IMAGE AND VIDEO PROCESSING 2016, 2016, 9897

[16] Paradigm changes in 3D-IC manufacturing [J].

Matthias, Thorsten ;

Lindner, Paul .

SOLID STATE TECHNOLOGY, 2013, 56 (05) :29-+

[17] Unified 3D-IC Multi-Chiplet System Design Solution [J].

Lay, Wang-Tyng .

PROCEEDINGS OF THE 2024 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, ISPD 2024, 2024, :83-83

[18] Electromigration Behavior of 3D-IC TSV Interconnects [J].

Frank, Thomas ;

Moreau, Stephane ;

Chappaz, Cedrick ;

Arnaud, Lucile ;

Leduc, Patrick ;

Thuaire, Aurelie ;

Anghel, Lorena .

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, :326-330

[19] 3D-IC Interconnect Test, Diagnosis, and Repair [J].

Chi, Chun-Chuan ;

Wu, Cheng-Wen ;

Wang, Min-Jer ;

Lin, Hung-Chih .

2013 IEEE 31ST VLSI TEST SYMPOSIUM (VTS), 2013,

[20] A 3D-IC technology with integrated microchannel cooling [J].

Sekar, Deepak ;

King, Calvin ;

Dang, Bing ;

Spencer, Todd ;

Thacker, Hiren ;

Joseph, Paul ;

Bakir, Muhannad ;

Meindl, James .

PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2008, :13-+

← 1 2 3 4 5 →