共 12 条
[1]
Li S.J., Liu Y., Hou X.L., Et al., Analysis and modeling of cutting force during machining of SiC monocrystal wafer, Journal of Mechanical Engineering, 51, 23, pp. 189-195, (2015)
[2]
Ishikawa Y., Yao Y.Z., Sugawara Y., Et al., Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining, Japanese Journal of Applied Physics, 53, 7, pp. 071301-071311, (2014)
[3]
Hardin C.W., Qu J., Shih A.J., Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafer, Advanced Manufacturing Processes, 19, 2, pp. 355-367, (2004)
[4]
Clark W.I., Shih A.J., Lemaster R.L., Et al., Fixed abrasive diamond wire machining-part II: experiment design and results, International Journal of Machine Tools & Manufacture, 43, 5, pp. 533-542, (2003)
[5]
Liedke T., Kuna M., A macroscopic mechanical model of the wire sawing process, International Journal of Machine Tools & Manufacture, 51, 9, pp. 711-720, (2011)
[6]
Li S.J., Du S.M., Tang A.F., Et al., Force modeling and control of SiC monocrystal wafer processing, Journal of Manufacturing Science and Engineering, 137, 6, pp. 061003-061010, (2015)
[7]
Cvetkovic S., Morsbach C., Rissing L., Ultra-precision dicing and wire sawing of silicon carbide (SiC), Microelectronic Engineering, 88, 8, pp. 2500-2504, (2011)
[8]
Wang J.B., Li S.J., Liang L., Et al., Modeling and experiment of contact arc length in SiC monocrystal wafer cutting, Acta Armamentarii, 37, 5, pp. 879-887, (2016)
[9]
Gao Y.F., Ge P.Q., Li S.J., Study on the cutting performance of single crystal silicon wafer by using reciprocating electroplated diamond wire saw, Journal of Synthetic Crystals, 38, 2, pp. 372-377, (2009)
[10]
Landers R.G., Ulsoy A.G., Ma Y.H., A comparison of model-based machining force control approaches, International Journal of Machine Tools & Manufacture, 44, 7, pp. 733-748, (2004)