Technologies for On-Board Optics

被引：0

作者：

Yamamoto T. ^{[1
]}

Akahoshi T. ^{[1
]}

Tsujino S. ^{[1
]}

Takahashi M. ^{[1
]}

Matsubara T. ^{[1
]}

机构：

[1] Research Institute for Advanced Materials and Device, KYOCERA Corporation, 3-5-3 Hikaridai, Seika-cho, Kyoto, Soraku-gun

来源：

Journal of Japan Institute of Electronics Packaging | 2023年 / 26卷 / 03期

关键词：

D O I：

10.5104/JIEP.26.236

中图分类号：

学科分类号：

摘要：

[No abstract available]

引用

页码：236 / 240

页数：4

共 11 条

[1]

Chopra R., Looking Beyond 400 G A System Vendor Perspective

[2]

Co-Packaging Framework DocumentOIF-Co-PackagingFD-01.0 February 3, 2022

[3]

COBO 8-Lane & 16-Lane On-Board Optics Specification Release 1.1

[4]

Okamoto D., Et al., High-Temperature Operation of Chip-Scale Silicon-Photonic Transceiver, 2020 IEEE Symposium on VLSI Technology

[5]

Nakamura T., Et al., Ultra-Compact and Highly Integrated Optical Transceiver Based on Silicon Photonics, 2022 27th OptoElectronics and Communications Conference (OECC) and 2022 International Conference on Photonics in Switching and Computing (PSC)

[6]

Minkenberg C., Et al., Co-packaged datacenter optics: Opportunities and challenges, IET Optoelectronics, 15, 2, pp. 77-91, (2021)

[7]

初めて学ぶ現場技術講座光インタコネクション入門, (2010)

[8]

QSFP-DD/QSFP-DD800/QSFP112 Hardware Specification for QSFPDOUBLE DENSITY 8X AND QSFP 4X PLUGGABLE TRANSCEIVERS - Rev 6. 3

[9]

Specification for OSFP OCTAL SMALL FORM FACTOR PLUGGABLE MODULE - Rev 6.3

[10]

400G QSFP-DD, OSFP, CFP8, COBO の規格違いを解説

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