Effect of solidification condition and strain rate on tensile properties and fracture behavior of Sn-58Bi solder

被引：0

作者：

Yan L. ^{[1
,2
]}

Zhou M. ^{[2
]}

Zhao X. ^{[2
]}

机构：

[1] Guangdong University of Science & Technology, Dongguan

[2] South China University of Technology, Guangzhou

来源：

Hanjie Xuebao/Transactions of the China Welding Institution | 2019年 / 40卷 / 05期

关键词：

Fracture behavior; Microstructure; Sn-58Bi solder; Tensile property;

D O I：

10.12073/j.hjxb.2019400131

中图分类号：

学科分类号：

摘要：

The tensile property and fracture behavior of the Sn-58Bi lead free solder solidified in water, air and furnace, respectively, are studied at different strain rate of 0.001, 0.002, 0.004 s-1. Results shown the eutectic structure of water cooling and air cooling Sn-58Bi solders is finer, in particular, the eutectic structure of air cooling solder is more uniform, while the eutectic structure of furnace cooling solder is coarse with serious microstructural segregation. The tensile strength of the solder becomes larger and the percentage elongation after fracture is smaller with increase of strain rate. Because of the accumulation of hard and brittle rich Bi which becomes from microstructural segregation in the Sn-58Bi solders, the tensile strength of furnace cooling solder is the maximum, however, its percentage elongation after fracture is the minimum, the fracture surface appears to be a typical brittle mode. The uniform eutectic structure can significantly improve the percentage elongation after fracture of the water cooling and air cooling Sn-58Bi solders, especially the percentage elongation after fracture of air cooling solder is maximum due to the best homogeneous eutectic organization, the fracture surface of air cooling solder is a brittle-ductility mixed fracture mode. © 2019, Editorial Board of Transactions of the China Welding Institution, Magazine Agency Welding. All right reserved.

引用

页码：79 / 83

页数：4

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