Study on the Thermal and Dielectric Properties of Epoxy Resin Modified by Boron Nitride Nanosheets

被引:0
|
作者
Zhang X. [1 ]
Hu G. [1 ]
Wu Y. [1 ]
Tang J. [1 ]
机构
[1] School of Electrical and Automation, Wuhan University, Wuhan
来源
基金
国家重点研发计划;
关键词
Boron nitride nanosheet; Dielectric properties; Epoxy resin; Thermal conductivity; Thermally stimulated current;
D O I
10.13336/j.1003-6520.hve.20200195
中图分类号
学科分类号
摘要
With the development of electrothermal density and miniaturization of power equipment, the insulating materials of power equipment are required to possess a better thermal con-ductivity. In order to solve the problem of low thermal conductivity of traditional epoxy resin(EP), boron nitride nanosheep(BNNS) was prepared by stripping hexagonal boron ni-tride and then incorporated into epoxy to obtain nanocomposites. The test results show that BNNS can effectively improve the thermal conductivity of epoxy resin, and the thermal conductivity of EP-BN with a volume fraction of 25% doping ratio is increased by 528% compared with that of pure epoxy resin. By measuring the dielectric spectrum of the com-posites, it is found that the addition of BNNS will increase the dielectric constant and dielectric loss of the composites, but the increase amplitude is not significant, and the in-crease of temperature will also increase the dielectric constant and dielectric loss of the composites. The trap parameters are obtained by analyzing the thermal stimulated current of the composites. BNNS can shallow the trap depth of EP-BN so as to reduce the energy needed for polarization charge generation, resulting in an increase of the dielectric constant and dielectric loss. The increase of temperature will hardly affect the dielectric depth of the material, but can lead to the increase of the amount of trapped charge, which is also mani-fested as the increase of dielectric constant and dielectric loss of the EP-BN. © 2021, High Voltage Engineering Editorial Department of CEPRI. All right reserved.
引用
收藏
页码:645 / 651
页数:6
相关论文
共 28 条
  • [11] DU Boxue, DU Qiang, LI Jin, Et al., Surface charge dynamic behaviors of Epoxy/BN composite with high thermal conductivity for gas insulated transmission pipeline, High Voltage Engineering, 44, 8, pp. 2646-2653, (2018)
  • [12] HSIEH C Y, CHUNG S L., High thermal conductivity epoxy molding compound filled with a combustion synthesized AlN powder, Journal of Applied Polymer Science, 102, 5, pp. 4734-4740, (2006)
  • [13] HOU G L, CHENG B L, DING F, Et al., Synthesis of uniform α-Si<sub>3</sub>N<sub>4</sub> nanospheres by RF induction thermal plasma and their application in high thermal conductive na-nocomposites, ACS Applied Materials & Interfaces, 7, 4, pp. 2873-2881, (2015)
  • [14] DONG H C, WEN B, ZHANG Y W, Et al., Thermal conductivity of Diamond/SiC na-no-polycrystalline composites and phonon scattering at interfaces, ACS Omega, 2, 5, pp. 2344-2350, (2017)
  • [15] CHEN Y M, TING J M., Ultra high thermal conductivity polymer composites, Carbon, 40, 3, pp. 359-362, (2002)
  • [16] LI J P, QI S H, ZHANG M Y, Et al., Thermal conductivity and electromagnetic shielding effec-tiveness of composites based on Ag-plating carbon fiber and epoxy, Journal of Applied Polymer Science, 132, 33, (2015)
  • [17] HUANG X Y, XIE L Y, HU Z W, Et al., Influence of BaTiO<sub>3</sub> nanoparticles on dielectric, thermophysical and mechanical properties of ethylene-vinyl acetate elastomer/BaTiO<sub>3</sub> microcomposites, IEEE Transactions on Dielectrics and Electrical Insulation, 18, 2, pp. 375-383, (2011)
  • [18] ZHANG X X, WEN H, CHEN X Y, Et al., Study on the thermal and dielectric properties of SrTiO<sub>3</sub>/epoxy nanocomposites, Energies, 10, 5, (2017)
  • [19] XUE C, BAI H, TAO P F., Analysis on thermal conductivity of graphite/Al composite by experi-mental and modeling study, Journal of Materials Engineering and Performance, 26, 1, pp. 327-334, (2017)
  • [20] AHMAD P, KHANDAKER M U, AMIN Y M., A simple technique to synthesise vertically aligned boron nitride nanosheets at 1 200 ℃, Advances in Applied Ceramics, 114, 5, pp. 267-272, (2015)