In-48Sn eutectic solder has the advantages of low melting point,high ductility,and good wettability,and is widely used in the soldering of microwave,communication,and other functional components. However,the mechanical properties of In-48Sn eutectic solder are poor,which made it difficult to meet the load requirements of the latest functional components. By adding trace alloys,nano-sized particles or fibers into In-Sn solders could improve the strength of them to a certain extent,but the strength improvements of joints using these solders were limited. Based on these,we prepared Ni foam strengthened In-48Sn composite solders by vacuum infiltration process,then using the as-fabricated composite solders to join Ag coated Al alloy at low temperature. Effects of Ni foam porosity and soldering time on the microstructure and mechanical properties of the joints were studied. Results showed that the Ag2 In intermetallic compound (IMC)layer formed on the Al alloy surface,the thickness of which increased with prolonging soldering time;moreover,the Ag2 In phase tended to form a block structure in the solder seam when there were no Ni skeleton barriers. A (Ni,Cu)3(In,Sn)7 phase formed during the reaction between In-48Sn solder and Ni skeletons. Prolonging the soldering time and reducing the porosity of Ni foams could both promote the formation of reaction phases and accelerate the consumption of In-48Sn solder,accompanied by the shear strength improvements of the joints. Finally,the soldering seam was completely composed of Ni skeleton and IMCs. The joint soldered with 50%Ni-In48Sn composite solder for 120 min obtained a shear strength of 34. 34 MPa,which was 335. 2% higher than that soldered with In-48Sn eutectic solder. © 2023 Cailiao Daobaoshe/ Materials Review. All rights reserved.