Effects of Y2O3 on the hot deformation behavior and microstructure evolution of Al2O3-cu/35Cr3TiB2 electrical contact composites

被引：4

作者：

Ma, Zipeng ^{[1
]}

Zhou, Meng ^{[1
]}

Li, Heng ^{[1
]}

Jing, Ke ^{[1
]}

Zhang, Jiacan ^{[1
]}

Tian, Baohong ^{[1
,2
]}

Zhang, Yi ^{[1
,2
]}

Li, Xu ^{[3
]}

Hu, Haoyan ^{[1
]}

Volinsky, Alex A. ^{[4
]}

机构：

[1] Henan Univ Sci & Technol, Sch Mat Sci & Engn, Prov & Ministerial Co Construct Collaborat Innova, Luoyang 471023, Peoples R China

[2] Henan Prov Key Lab Nonferrous Mat Sci & Proc Tech, Luoyang 471023, PR, Peoples R China

[3] Natl Inst Metrol, Ctr Adv Measurement Sci, Beijing 100029, Peoples R China

[4] Univ S Florida, Dept Mech Engn, 4202 Fowler Ave ENG 030, Tampa, FL 33620 USA

来源：

MATERIALS CHARACTERIZATION | 2024年 / 215卷

基金：

中国国家自然科学基金;

关键词：

Copper-based composites; Hot deformation behavior; Dynamic recrystallization; Microstructure evolution; ARC EROSION BEHAVIOR; DYNAMIC RECRYSTALLIZATION; NANOCOMPOSITES; AL2O3-CU/(W;

D O I：

10.1016/j.matchar.2024.114120

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The Al2O3-Cu/35Cr(3)TiB(2) and 0.5Y(2)O(3)/Al2O3-Cu/35Cr(3)TiB(2) composites were prepared by a combination of fast hot compression sintering and internal oxidization. The effects of Y2O3 on the hot deformation behavior and microstructure evolution of the composites were investigated. According to the hot deformation data, the constitutive equations, hot processing maps, and critical dynamic recrystallization models were constructed for the two composites. The Y2O3 addition enhanced the flow stress, activation energy, and hot processing properties of the composites. This led to a reduction in the percentage of dynamic recrystallization structure from 25.3% to 19.4%, and decreased the amount of high-angle grain boundaries from 77.8% to 71.4%. Y2O3 was distributed at grain boundaries and phase interfaces, effectively impeding dislocation movement and grain boundary migration. Notably, the strain distribution within Y2O3 exhibited greater homogeneity compared to the Cu matrix. More twins and stacking faults were observed inside the 0.5Y(2)O(3)/Al2O3-Cu/35Cr(3)TiB(2) composites, which synergistically strengthened the matrix.

引用

页数：15

共 40 条

[11] Microstructure evolution of graphene reinforced Cu/CeO2/Cr electrical contact materials under thermal deformation behavior [J].