TLP diffusion bonding of TC4 titanium alloy with electrodeposited Ni/Cu interlayers

被引：0

作者：

Lin T. ^{[1
]}

Xie H. ^{[2
]}

Zhang Q.-L. ^{[2
]}

Zhao W.-Q. ^{[1
]}

Si X.-Q. ^{[1
]}

Li C. ^{[1
]}

Chen H.-Z. ^{[2
]}

Fu M.-Y. ^{[2
]}

Qi J.-L. ^{[1
]}

Cao J. ^{[1
]}

机构：

[1] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin

[2] Xi’an Space Engine Co., Ltd., Xi’an

来源：

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2023年 / 33卷 / 05期

基金：

中国国家自然科学基金;

关键词：

diffusion bonding; mechanical properties; microstructure; TC4 titanium alloy; transient liquid phase;

D O I：

10.11817/j.ysxb.1004.0609.2022-43422

中图分类号：

学科分类号：

摘要：

The TLP diffusion bonding of TC4 titanium alloy was achieved using electrodeposited Ni/Cu interlayers. The interfacial microstructure of the joint was analyzed by scanning electron microscopy equipped with energy disperse spectroscopy and X-ray diffractometer, and the reaction mechanism was illustrated by Ti-Cu and Ti-Ni binary phase diagram. The results show that the typical interfacial microstructure of the joint is TC4/ α -Ti+Ti2(Cu, Ni)/Ti3Cu4+TiCu+Ti2(Cu, Ni)/α -Ti+Ti2(Cu, Ni)/TC4, and Ni element exists in the form of solid solution. As the increase of the bonding temperature, Ti3Cu4, TiCu and Ti2(Cu, Ni) with high Al and V content in the central reaction zone disappear, whereas the width of Ti2(Cu, Ni) phase decreases significantly. Simultaneously, The lumpy Ti2(Cu, Ni) phase appears finely feathery or dendritic structure. When the temperature reaches 960 ℃, the microstructure is basically the same, and the elements in the joint are fully homogenized. In this process, the tensile strength and shear strength of the joints increase gradually, reaching the maximum values of 519 MPa and 195 MPa at 960 ℃, respectively. © 2023 Central South University of Technology. All rights reserved.

引用

页码：1390 / 1398

页数：8

共 18 条

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