Message from the Chairs: TechDebt 2023

被引：0
|
作者：
Treude, Christoph [1 ]
Cai, Yuanfang [2 ]
Xia, Xin [3 ]
Codabux, Zadia [4 ]
Hata, Hideaki [5 ]
Deissenboeck, Florian [6 ]
Spinola, Rodrigo [7 ]
机构：
[1] The University of Melbourne, Australia
[2] Drexel University, United States
[3] Huawei, China
[4] University of Saskatchewan, Canada
[5] Shinshu University, Japan
[6] Cqse GmbH, Germany
[7] Virginia Commonwealth University, United States
来源：
Proceedings - 2023 ACM/IEEE International Conference on Technical Debt, TechDebt 2023 | 2023年
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D O I：
10.1109/TechDebt59074.2023.00005
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