共 24 条
- [1] JUNG I, SONG S, CHOI M, Et al., Evolution of mechanically formed bow due to surface waviness and residual stress difference on sapphire (0001) substrate, Journal of Materials Processing Technology, 269, pp. 102-108, (2019)
- [2] KHATTAK C P, SHETTY R, SCHWERDTFEGER C R, Et al., World′s largest sapphire for many applications, Journal of Crystal Growth, 452, pp. 44-48, (2016)
- [3] ZHOU Y, PAN G SH, GONG H, Et al., Characterization of sapphire chemical mechanical polishing performances using silica with different sizes and their removal mechanisms [ J], Colloids and Surfaces. A, Physicochemical and Engineering Aspects, 513, pp. 153-159, (2017)
- [4] YIN SH H, WANG Y Q, LI Y P, Et al., Experimental study on magnetorheological chemical polishing for sapphire substrate, Journal of Mechanical Engineering, 52, 5, pp. 80-87, (2016)
- [5] GAN Y, ZHANG F H., Review on formation mechanism of chemical reaction layer during chemical mechanical polishing of monocrystalline SiC and sapphire substrates, Science China Press, 61, 36, pp. 3930-3939, (2016)
- [6] YUAN J L, CUI L F, ZHANG R Y, Et al., Research on nanoprocessing technology of sapphire single crystal, Chinese Journal of Scientific Instrument, 16, 1, pp. 187-192, (1995)
- [7] ZHANG ZH Y, LIU J, HU W, Et al., Chemical mechanical polishing for sapphire wafers using a developed slurry [ J ], Journal of Manufacturing Processes, 62, pp. 762-771, (2021)
- [8] WANG X, LEI H, CHEN R L., CMP behavior of alumina/ metatitanic acid core-shell abrasives on sapphire substrates, Precision Engineering, 50, pp. 263-268, (2017)
- [9] LUO Q F, LU J, XU X P, Et al., Removal mechanism of sapphire substrates (0001, 11 0 and 10 0) in mechanical planarization machining [ J ], Ceramics International, 43, 18, pp. 16178-16184, (2017)
- [10] FUJIWARA H., Spectroscopic ellipsometry: Principles and applications [ M], (2007)