Effect of Aluminum Powder Size and Temperature on Mechanical Properties of Hot Pressed 15%SiC/2009Al Composite

被引：0

作者：

Bian P. ^{[1
,2
]}

Han X. ^{[3
]}

Zhang J. ^{[1
]}

Zhu S. ^{[1
]}

Xiao B. ^{[1
]}

Ma Z. ^{[1
]}

机构：

[1] Shi-changxu Innovation Center for Advanced Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang

[2] School of Materials Science and Engineering, Shenyang Ligong University, Shenyang

[3] Beijing Institute of Spacecraft System Engineering, Beijing

来源：

Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research | 2024年 / 38卷 / 06期

关键词：

aluminum powder size; composite; hot pressing temperature; mechanical property; powder metallurgy;

D O I：

10.11901/1005.3093.2023.125

中图分类号：

学科分类号：

摘要：

Hot pressed Al-based composites of 15% SiC/2009A1 (volume fraction) were prepared by powder metallurgy method. The effect of the variation of Al powder sizes (13 μm, 32 μm) and temperatures (560oC, 580oC, 600oC) on their microstructure and mechanical property was studied using optical microscopy (OM), scanning electron microscopy (SEM), electron probe microanalysis (EPMA) and tensile tests. The results show that the composite prepared with small Al powders has higher strength and ductility than that prepared with large Al powders. The reason could be attributed to the following three aspects. First, large Al powders result in the uneven distribution of SiC particles in the matrix. Secondly, in the composites prepared with large Al powders, Cu and Mg spread unevenly and which then react with the extrinsic contaminants such as Fe and O, forming large-sized insoluble phases. Thirdly, in the composite prepared with large Al powders, the bonding between SiC particles and the aluminum matrix is weak, which is particularly obvious when the hot pressing temperature is low, resulting in debonding of SiC-Al interface during tensile tests. The fracture mechanism of the composites prepared with the two Al powders was analyzed. At all hot-pressing temperatures, the composites prepared with small Al powders are fractured due to the tearing of the Al-matrix and fracture of SiC partculates. However, for the composite prepared with large Al powders, SiC particles and aluminum matrix tend to debond when hot pressing at low temperature, while the interfacial bonding is improved with the increase of hot pressing temperature. When hot pressing at 580oC, the mechanical properties of the composites are the best, especially for that withsmall Al powders. Correspondingly, the tensile strength and yield strength reach 556 MPa and 381 MPa respectively, and the elongation reaches 9.2%. © 2024 Chinese Journal of Materials Research. All rights reserved.

引用

页码：401 / 409

页数：8

共 27 条

[1] Milind S M, Uddha M S., An investigation of mechanical properties of aluminium based silicon carbide (AlSiC) metal matrix composite by different manufacturing methods, Mater. Today, 44, (2021)
[2] Huang G Q, Wu J, Hou W T, Et al., A novel two-step method to prepare fine-grained SiC/Al-Mg-Sc-Zr nanocomposite: Processing, microstructure and mechanical properties, Mater. Sci. & Eng.: A, 823, (2021)
[3] Nam D H, Kim Y K, Cha S I, Et al., Effect of CNTs on precipitation hardening behavior of CNT/Al-Cu composites, Carbon, 50, 13, (2012)
[4] Liu Z Y, Xiao B L, Wang W G, Et al., Singly dispersed carbon nano-tube/aluminum composites fabricated by powder metallurgy combined with friction stir processing, Carbon, 50, 5, (2012)
[5] Styles M J, Hutchinson C R, Chen Y, Et al., The coexistence of two S (Al<sub>2</sub>CuMg) phases in Al-Cu-Mg alloys [J], Acta Mater, 60, 20, (2013)
[6] Song M, Xiao D H., Modeling the fracture toughness and tensile ductility of SiCp/Al metal matrix composites, Mater. Sci. & Eng.: A, 474, 1-2, (2008)
[7] Singh K K, Singh S, Shrivastava A K., Comparison of wear and friction behavior of aluminum matrix alloy (Al 7075) and silicon carbide based aluminum metal matrix composite under dry condition at different sliding distance, Mater. Today, 4, (2016)
[8] Chen M Q, Bai Y L, Zhang Z F, Et al., Research progress on preparation of SiC/Al for electronic packaging by liquid infiltration, Mater. Sci. Forum, 1035, (2021)
[9] Liu G F, Chen T J, Wang Z J., Effects of solid solution treatment on microstructure and mechanical properties of SiCp/2024 Al composite: A comparison with 2024 Al alloy, Mater. Sci. & Eng.: A, 817, (2021)
[10] Lee J C, Shim J H, Lee H I, Et al., Methodology to design the interfaces in SiC-Al composites, Metall. Mater. Trans, A32, (2001)

← 1 2 3 →