Causal Model Implementation for the Conductor Surface Roughness Effect on the Attenuation and Delay of Microstrip Lines

被引:3
|
作者
Serrano-Serrano, Maria T. [1 ]
Torres-Torres, Reydezel [1 ]
机构
[1] INAOE, Dept Elect, Puebla 72840, Mexico
基金
欧洲研究理事会;
关键词
Electromagnetic (EM) simulations; microstrip lines; S-parameters; surface roughness; METHODOLOGY; INDUCTANCE; SERIES;
D O I
10.1109/TMTT.2023.3285425
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The conductor surface roughness effect on microstrip lines is physically represented by proposing a step-by-step methodology that uses experimental S-parameters supported by electromagnetic (EM) simulations assuming smooth conductor surfaces. This avoids implementing the microstrip line model by arbitrarily fitting simulations with experimental data that include multiple-frequency-dependent effects. Furthermore, a priori knowledge of the roughness profile is not required in this proposal. From the analysis, the peak-to-valley feature of the surface roughness that allows for the representation of the corresponding effect on the electrical response of the lines is obtained. The implemented models show a correlation with experimental data up to 35 GHz.
引用
收藏
页码:64 / 73
页数:10
相关论文
共 50 条
  • [1] Simple conductor roughness modeling for microstrip lines
    Huang, Binke
    Wang, Xubing
    Vandenbosch, Guy A. E.
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2019, 61 (08) : 1999 - 2002
  • [2] EM modeling of microstrip conductor losses including surface roughness effect
    Chen, Xiaoming
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2007, 17 (02) : 94 - 96
  • [3] Causal Version of Conductor Roughness Models and its Effect on Characteristics of Transmission Lines
    Dmitriev-Zdorov, Vladimir
    Simonovich, Lambert
    2017 IEEE 26TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS), 2017,
  • [4] Surface Roughness Effect From Different Surfaces of Microstrip Lines and Reference Plane
    Liu, Yuanzhuo
    Guo, Yuandong
    Li, Chaofeng
    Ye, Xiaoning
    Kim, Donghyun
    IEEE LETTERS ON ELECTROMAGNETIC COMPATIBILITY PRACTICE AND APPLICATIONS, 2023, 5 (03): : 92 - 96
  • [5] Surface Roughness Effect from Different Surfaces of Microstrip Lines and Reference Plane
    Liu, Yuanzhuo
    Guo, Yuandong
    Li, Chaofeng
    Ye, Xiaoning
    Kim, DongHyun
    2022 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & SIGNAL/POWER INTEGRITY, EMCSI, 2022, : 291 - 291
  • [6] Full-wave Simulation of an Imbalanced Differential Microstrip Line with Conductor Surface Roughness
    Koledintseva, Marina
    Vincent, Tracey
    Radu, Sergiu
    2015 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND SIGNAL INTEGRITY, 2015, : 34 - 39
  • [7] A modified model of conductor roughness for manufacturing copper lines of printedcircuit board
    Wang, Chong
    Wang, Yingjie
    Adi, Kegu
    Huang, Yunzhong
    Chen, Yuanming
    Wang, Shouxu
    He, Wei
    Tang, Yao
    Sun, Yukai
    Zhang, Weihua
    Xu, Chenggang
    He, Xuemei
    CIRCUIT WORLD, 2022, 48 (04) : 493 - 501
  • [8] ON THE SURFACE IMPEDANCE USED TO MODEL THE CONDUCTOR LOSSES OF MICROSTRIP STRUCTURES
    THERON, IP
    CLOETE, JH
    IEE PROCEEDINGS-MICROWAVES ANTENNAS AND PROPAGATION, 1995, 142 (01) : 35 - 40
  • [9] Evaluation of the Microstrip Lines Connectors in the Meander Delay Line Model
    Gurskas, A.
    Urbanavicius, V.
    Martavicius, R.
    ELEKTRONIKA IR ELEKTROTECHNIKA, 2010, (03) : 39 - 42
  • [10] FIELD COMPUTATION FOR MICROSTRIP AND SLOT LINES AND CURRENT DISTRIBUTIONS FOR SLOT LINES AND THEIR EFFECT ON CONDUCTOR LOSSES
    SCHUMACHER, W
    LEHMANN, R
    AEU-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS, 1979, 33 (10): : 417 - 420