Rapid pressure-assisted sinter bonding in air using 200 nm Cu particles and enhancement of bonding strength by successive pressureless annealing

被引：1
作者：
KIM M.I. [1 ]
LEE J.-H. [1 ]
机构：
[1] Department of Materials Science and Engineering, Seoul National University of Science and Technology, 232 Gongneung-ro, Seoul, Nowon-gu
来源：
Transactions of Nonferrous Metals Society of China (English Edition) | 2022年 / 32卷 / 02期
关键词：
Cu paste; malic acid; shear strength; sinter bonding; submicron Cu particles; successive annealing;
D O I：
10.1016/S1003-6326(22)65821-7
中图分类号：
学科分类号：
摘要：
To design an effective and realistically applicable sinter bonding process for power devices, we proposed a two-step process using a 200 nm Cu-particle-based paste to form a bondline having high-temperature sustainability and superior thermal conductance. This process involved rapid pressure-assisted sinter bonding in air followed by pressureless annealing in a nitrogen atmosphere. In the case of a paste prepared with a mixture of 20 wt.% malic acid and 80 wt.% ethylene glycol, sinter bonding at 300 °C and 5 MPa for only 30 s resulted in a sufficient shear strength of 23.1 MPa. The shear strength was significantly enhanced to 69.6 MPa by the additional pressureless aging for 30 min. Therefore, the two-step sinter bonding process is expected to provide an outstanding production rate as a next-generation sinter bonding process. © 2022 The Nonferrous Metals Society of China
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页码：629 / 638
页数：9
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