Current and potential applications of additive manufacturing for power electronics

被引：9

作者：

Lopera L. ^{[1
]}

Rodriguez R. ^{[1
]}

Yakout M. ^{[1
]}

Elbestawi M. ^{[1
]}

Emadi A. ^{[1
]}

机构：

[1] Mechanical Eng, McMaster University, Hamilton, L8P 0A6, ON

来源：

IEEE Open Journal of Power Electronics | 2021年 / 2卷

基金：

加拿大自然科学与工程研究理事会;

关键词：

Additive manufacturing; electrified transportation; passive component design; power electronics; thermal management;

D O I：

10.1109/OJPEL.2021.3052541

中图分类号：

学科分类号：

摘要：

To meet the upcoming challenges of higher power density and higher efficiency for power electronics, a system level approach to the design of power electronic devices must be carried out. Higher system integration and packaging will allow for more compact designs but will also result in challenges for component manufacturing and thermal management. Additive manufacturing can potentially mitigate some of these challenges due to the design flexibility and intricate features that additive manufacturing methods can provide. This paper presents an overview of the additive manufacturing technologies currently in practice at the academic and industry level. A detailed review is presented of current applications of additive methods for the production of power electronic components, advanced heat exchanger designs and integrated power electronic systems. © 2020 IEEE.

引用

页码：33 / 42

页数：9

共 66 条

[1]

Ma S., Pitman A., Hart M., Evans J.P., Haghdadi N., MacGill I., The impact of an urban canopy and anthropogenic heat fluxes on Sydney's climate, Int. J. Climatol., 37, 1, pp. 255-270, (2017)

[2]

Monostori L., AI and machine learning techniques for managing complexity, changes and uncertainties in manufacturing, IFAC Proc. Volumes (IFAC-PapersOnline), 15, 1, pp. 119-130, (2002)

[3]

Additive manufacturing-Design-requirements, guidelines and recommendations, West Conshohocken, PA, (2018)

[4]

Wohlers T., Gornet T., History of additive manufacturing introduction of non-SL systems introduction of low-cost 3D printers, Wohlers Report 2012, pp. 1-23, (2012)

[5]

Lantada A.D., Morgado P.L., Rapid prototyping for biomedical engineering: Current capabilities and challenges, Annu. Rev. Biomed. Eng., 14, 1, pp. 73-96, (2012)

[6]

Bindra A., Wide-bandgap-based power devices reshaping the power electronics landscape, IEEE Power Electron. Mag., 2, 1, pp. 42-47, (2015)

[7]

Marlino L., FreedomCAR and DOE roadmap for automotive power electronics 3/4 DOE and FreedomCAR partnership 3/4 program packaging challenges 3/4 roadmap overview 3/4 power electronics in the program 3/4 government/industrial partnerships and opportunities, Dept. Energy, Fort Worth, (2011)

[8]

Emadi A., Lee Y.J., Rajashekara K., Power electronics and motor drives in electric, hybrid electric, and plug-in hybrid electric vehicles, IEEE Trans. Ind. Electron., 55, 6, pp. 2237-2245, (2008)

[9]

Yan Y., Ngo K.D., Mei Y., Lu G.Q., Additive manufacturing of magnetic components for power electronics integration, Proc. Int. Conf. Electron. Packag, pp. 368-371, (2016)

[10]

Yang C., Wu S.Y., Glick C., Choi Y.S., Hsu W., Lin L., 3D printed RF passive components by liquid metal filling, Proc. IEEE Int. Conf. Micro Electro Mech. Syst., pp. 261-264, (2015)

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