Using Arduino and Finite Element Modeling to Integrate Instrumentation and Solid Mechanics Courses

被引:0
|
作者
Santos, Jorge Herrera [1 ]
Sanchez, Raul Munoz [1 ]
Simon, Federico Lopez [1 ]
Vega Barroso, Miguel Angel [1 ]
Hernandez, Esteban Sanchez [1 ]
机构
[1] Univ Salamanca, ETS Ingn Ind, Bejar, Spain
来源
2024 XVI CONGRESO DE TECNOLOGIA, APRENDIZAJE Y ENSENANZA DE LA ELECTRONICA, TAEE 2024 | 2024年
关键词
Arduino; Instrumentation; IoT; LoRaWAN; Finite Element Analysis;
D O I
10.1109/TAEE59541.2024.10604990
中图分类号
G40 [教育学];
学科分类号
040101 ; 120403 ;
摘要
An integrated approach is presented for designing practical sessions for two graduate-level courses within the MSc in Industrial Engineering: "Electronic Systems and Industrial Engineering" and "Solid Mechanics". The use of Arduino facilitates the development of a comprehensive and cost-effective hands-on program aimed at exploring different sensor types and investigating communication buses such as SPI or I2C, as well as LoRaWAN communication in Internet of Things (IoT) applications. This is accompanied by the preliminary analysis of a load cell using finite element simulations. Through these lab sessions, students will not only enhance their skills in sensor technology and computing but also gain valuable experience in designing complete embedded systems with various internal communication buses and external connectivity, thereby fostering a multidisciplinary learning environment.
引用
收藏
页数:6
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