High temperature resistant composite adhesive with a remarkable bonding strength in a wide temperature range from 25 °C to 1200 °C

Ensuring a consistently high-strength connection in superalloy components of space shuttles from 25 to 1200 degrees C is essential yet challenging. To achieve the objective, we developed an adhesive using silicon-boron modified phenolic resin (Si-BPF) as the matrix and inorganic fillers as additives. The continuous Si-O-Si-O-B-O-B skeleton endowed the Si-BPF with excellent thermal stability. In addition, the inorganic fillers inhibited the thermal decomposition of Si-BPF. The generation of low-melting-point glass phases compensated for the defects in the adhesive. Therefore, within the "300-600 degrees C weak strength interval", the synergistic effect of Si-BPF and inorganic additives increased the adhesive strength to 17.26 MPa. The formation of intermetallic compounds and the ceramization of the adhesive resulted in a gradual increase in the bonding strength of the composite adhesive with increasing temperature, reaching 34.23 MPa after 1200 degrees C. The adhesive enabled high-strength bonding for superalloys throughout the wide temperature range, enhancing the application of superalloy components in space shuttles.