Scalable Fabrication of Large-Scale, 3D, and Stretchable Circuits

Stretchable electronics have demonstrated excellent potential in wearable healthcare and conformal integration. Achieving the scalable fabrication of stretchable devices with high functional density is the cornerstone to enable the practical applications of stretchable electronics. Here, a comprehensive methodology for realizing large-scale, 3D, and stretchable circuits (3D-LSC) is reported. The soft copper-clad laminate (S-CCL) based on the "cast and cure" process facilitates patterning the planar interconnects with the scale beyond 1 m. With the ability to form through, buried and blind VIAs in the multilayer stack of S-CCLs, high functional density can be achieved by further creating vertical interconnects in stacked S-CCLs. The application of temporary bonding substrate effectively minimizes the misalignments caused by residual strain and thermal strain. 3D-LSC enables the batch production of stretchable skin patches based on five-layer stretchable circuits, which can serve as a miniaturized system for physiological signals monitoring with wireless power delivery. The fabrications of conformal antenna and stretchable light-emitting diode display further illustrate the potential of 3D-LSC in realizing large-scale stretchable devices. 3D-LSC enables the fabrication of large-scale, 3D, and stretchable circuits. Soft copper-clad laminates and multiple types of VIAs are employed to create large-scale planar interconnects and vertical interconnects. A temporary bonding strategy is proposed to mitigate misalignment with residual and thermal strains. 3D-LSC facilitates batch production of miniaturized multifunctional devices and the fabrication of large-scale stretchable devices. image